EPM2210GF324I5N vs EPM2210GF324C5 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM2210GF324I5N sa pamamagitan ng Intel at EPM2210GF324C5 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPM2210GF324C5 - MAX II 2210 LE CPLD, 324-BGA, 5ns | Intel/Altera
EPM2210GF324C5 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EPM2210GF324I5N | EPM2210GF324C5 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Device Family | MAX II | — |
| Logic Elements | 2210 | — |
| Equivalent Macrocells | 1700 | 1,700 |
| User I/O | 272 | — |
| Propagation Delay (tPD) | 7 ns | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Packhaging | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch | 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Core Voltage (VCCINT) | 1.8 V (typical) | 1.8 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Temperature na Operasyon | -40 °C to +100 °C (TJ) | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 6-layer-metal flash, 0.18 um |
| Programmability | In-System Programmable (JTAG / ISP) | — |
| Lead Free / RoHS | Yes (RoHS compliant) | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | MAX II |
| Device Name | — | EPM2210 |
| Logic Elements (LE) | — | 2,210 |
| Maximum User I/Os | — | 272 |
| Pin-to-Pin Delay (tPD1) | — | 5 ns (C5 speed grade) |
| Internal Performance | — | 304 MHz |
| I/O Voltage (VCCIO) - MultiVolt | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Temperature ng Junction na Operasyon | — | 0C to +85C (commercial) |
| In-System Programmability | — | JTAG (IEEE 1149.1) |
| Tindminan RoHS | — | Compliant (lead-free) |