EPM570F256C3N vs EPM570F256C5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM570F256C3N sa pamamagitan ng Intel at EPM570F256C5N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPM570F256C3N | EPM570F256C5N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX II | MAX II |
| Logic Elements (LEs) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Maximum Operating Frequency | 304 MHz | 304 MHz |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | 0.18 um |
| Core Voltage | 2.5 V / 3.3 V | — |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Packhaging | 256-ball FBGA (FineLine BGA) | 256-FBGA (FineLine BGA) |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | 160 |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | — |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | JTAG (IEEE 1149.1), in-system |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL level not stated in provided data] | — |
| Tindminan RoHS | Compliant (per DigiKey listing) | — |
| Lead-Free | Yes (per suffix 'N' convention) | — |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | — |
| Logic Elements | — | 570 |
| Number of Macrocells | — | 440 |
| Internal Supply Voltage | — | 2.5 V / 3.3 V |
| Pin-to-Pin Delay (tPD) | — | 5.4 ns |
| User Flash Memory | — | 8 Kbits |
| Program Memory Type | — | Non-volatile Flash |
| MultiVolt I/O Support | — | 1.5V / 1.8V / 2.5V / 3.3V |
| Temperature na Operasyon | — | 0C to 85C (TJ) |