EPM570GF256C4 vs EPM570GF256C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM570GF256C4 sa pamamagitan ng Intel at EPM570GF256C4N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EPM570GF256C4N - 570 LEs CPLD, 4ns, 212 I/O, FBGA-256 | Intel / Altera
EPM570GF256C4N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EPM570GF256C4 | EPM570GF256C4N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX II | MAX II G |
| Logic Elements (LEs) | 570 | 570 |
| Macrocells | 440 | 440 |
| Maximum User I/Os | 212 | — |
| Pin-to-Pin Delay (tPD) | 5.4 ns | 4 ns |
| Supply Voltage VCCINT | 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) | — |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) | — |
| Temperature na Operasyon | 0 °C to +85 °C (commercial) | -40 °C to +125 °C (industrial) |
| Packhaging | 256-ball FBGA (FineLine BGA) | 256-ball FineLine BGA (FBGA-256) |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Process Technology | 0.18 µm CMOS, flash-based configuration | — |
| JTAG Support | IEEE 1149.1 boundary-scan + ISP | — |
| Configuration Memory | Non-volatile flash (instant-on, no boot PROM) | Flash (non-volatile, instant-on) |
| Tindminan RoHS | Lead-free, RoHS compliant | — |
| Device Series | — | EPM570G |
| User I/Os | — | 212 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Speed Grade | — | C4 (tPD = 4 ns) |
| Internal fMAX | — | 304 MHz |
| Package Dimensions | — | 17 x 17 mm |
| Core Voltage | — | 1.8 V |
| I/O Bank Voltages (MultiVolt) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Programming Interface | — | JTAG (IEEE 1149.1), in-system programmable |
| Lead-Free / RoHS | — | Lead-free, FBGA package |