K3LK4L40DM-BGCT vs K3LK8L80CM-MGCT Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng K3LK4L40DM-BGCT sa pamamagitan ng Samsung Electronics at K3LK8L80CM-MGCT sa pamamagitan ng Samsung Electronics. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Samsung Electronics
K3LK4L40DM-BGCT - Samsung DRAM Memory IC | Samsung Electronics
K3LK4L40DM-BGCT ✓ NakahandaSamsung Electronics
K3LK8L80CM-MGCT - LPDDR5X 32Gbit DRAM FBGA-315 | Samsung
K3LK8L80CM-MGCT ✓ NakahandaPagsanggunian na paghahambing
| Parametro | K3LK4L40DM-BGCT | K3LK8L80CM-MGCT |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Kategorya | DRAM | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | DRAM (SDRAM component) | LPDDR5X SDRAM |
| Manufacturer | Samsung Electronics | — |
| Density | [DATA_NEEDED: Density] | 32 Gbit (4 GB) |
| Organization (x-width) | [DATA_NEEDED: Organization] | — |
| Rate ng Data | [DATA_NEEDED: Data Rate] | — |
| Supply Voltage Class | [DATA_NEEDED: Supply Voltage] | — |
| Latensya ng CAS | [DATA_NEEDED: CAS Latency] | — |
| Package Type | BGA (per -BGC ordering-code suffix) | — |
| Package Ball Count | [DATA_NEEDED: Ball Count] | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | [DATA_NEEDED: Operating Temperature Range] | -25C to +85C |
| Refresh Rate | [DATA_NEEDED: Refresh Interval] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS Status] | Compliant (per JLCPCB listing) |
| Lead Free | [DATA_NEEDED: Lead-Free Status] | — |
| Level ng MSL | [DATA_NEEDED: Moisture Sensitivity Level] | [DATA_NEEDED: MSL level] |
| Packaging | Tape & Reel (per -T-style suffix convention) [DATA_NEEDED: confirmed packaging] | — |
| Organisasyon | — | x32 |
| Max Data Rate | — | 7500 Mbps |
| Supply Voltages | — | 0.5 V, 900 mV, 1.05 V, 1.8 V (multi-rail) |
| Packhaging | — | FBGA-315 (315-ball) |
| Interface | — | LPDDR5X (JEDEC low-power DDR) |
| Power Efficiency | — | ~25% improvement vs LPDDR5 |
| Application Class | — | Mobile, PC, automotive, on-device AI |
| Speed Grade Suffix | — | CM-MGCT |
| Package Family | — | FBGA -> BGA -> surface mount |
| Typical End Products | — | Smartphones, tablets, edge AI devices |
| Refresh / Standby Modes | — | Self-refresh, deep power-down (per LPDDR5X protocol) |