K9DUGB8S7M vs K9HQGY8S5M Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng K9DUGB8S7M sa pamamagitan ng Samsung Electronics at K9HQGY8S5M sa pamamagitan ng Samsung Electronics. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Samsung Electronics
K9DUGB8S7M K9DUGB8S7M - Samsung NAND Flash Memory IC | Samsung

K9DUGB8S7M - Samsung NAND Flash Memory IC | Samsung

K9DUGB8S7M ✓ Nakahanda
Samsung Electronics
K9HQGY8S5M K9HQGY8S5M - 3D V-NAND Flash, FBGA-316 | Samsung | SSD Storage

K9HQGY8S5M - 3D V-NAND Flash, FBGA-316 | Samsung | SSD Storage

K9HQGY8S5M ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro K9DUGB8S7M K9HQGY8S5M
Brand Samsung Electronics Samsung Electronics
Kategorya Memory ICs Memory ICs
Katayuan ng Lifecycle Aktibo Aktibo
Uri ng Memory NAND Flash —
Manufacturer Samsung Electronics Samsung Electronics
Ordering Code K9DUGB8S7M-DCK0 —
Interface [DATA_NEEDED: interface type (x8/x16 asynchronous NAND)] NAND (ONFI/Toggle-style asynchronous interface) - exact timing mode [DATA_NEEDED: interface timing mode]
Memory Capacity [DATA_NEEDED: total capacity] —
Page Size [DATA_NEEDED: page size] [DATA_NEEDED: page size]
Block Size [DATA_NEEDED: block size] [DATA_NEEDED: block size]
Volte ng Pagbibigay [DATA_NEEDED: supply voltage range] [DATA_NEEDED: VCC range]
Package Type [DATA_NEEDED: package type] 316-ball Fine Pitch BGA (FBGA-316)
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Access Time / Timing Grade [DATA_NEEDED: speed grade] —
Temperature na Operasyon [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Endurance [DATA_NEEDED: program/erase cycles] —
ECC Requirement [DATA_NEEDED: ECC scheme] —
Tindminan RoHS [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS status]
Level ng MSL [DATA_NEEDED: moisture sensitivity level] [DATA_NEEDED: moisture sensitivity level]
Product Type — 3D V-NAND Flash Memory (stacked, client NAND)
Die Configuration — 4 x K9ADGD8S0A V-NAND dies (per TechInsights package analysis)
NAND Technology — 32-layer pMLC 3D V-NAND (per Samsung 850 Pro 256 GB analysis)
Memory Class — Non-volatile NAND flash
Density — [DATA_NEEDED: total bit density]
Program/Erase Cycles — [DATA_NEEDED: P/E endurance rating]
Original Application — Samsung SSD 850 Pro solid-state drive

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