M1AFS1500-1FG256K vs M1AFS1500-1FG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS1500-1FG256K sa pamamagitan ng Microchip Technology at M1AFS1500-1FG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS1500-1FG256K - Fusion FPGA 1.5M Gates ARM Cortex-M1 | Microchip
M1AFS1500-1FG256K ✓ NakahandaMicrochip Technology
M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip
M1AFS1500-1FG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M1AFS1500-1FG256K | M1AFS1500-1FG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer | Microchip Technology | — |
| Family | Fusion (Mixed-Signal Flash FPGA) | — |
| System Gates | 1500000 | — |
| Logic Cells | 38400 | — |
| Number of I/O | 119 | — |
| Flash Memory | 276480 bits | — |
| Processor Core | ARM Cortex-M1 (soft core) | ARM Cortex-M1 (M1 variant) |
| Speed Grade | -1 | -1 (standard) |
| Packhaging | 256-LBGA (FG256) | 256-LBGA (FG256) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Technology | Flash (instant-on, single-chip) | Flash-based, nonvolatile |
| Analog Features | Configurable analog blocks (Fusion mixed-signal) | — |
| Programmability | In-System Programmable | — |
| Tindminan RoHS | RoHS Non-Compliant | Non-Compliant (contains lead, per distributor data) |
| Lead Free Status | Contains Lead | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial grade, suffix I) |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | 1.5 V |
| Embedded Memory Blocks | [DATA_NEEDED: SRAM block size] | — |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Logic Capacity | — | 1,500,000 system gates |
| User I/O | — | 119 |
| Memory Resource | — | 276480 bits |
| Process Technology | — | 130 nm CMOS, 7-layer metal |
| System Performance | — | up to 350 MHz |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Analog Functionality | — | Fusion configurable analog blocks |
| Clock Management | — | Integrated clock generation and management circuitry |
| Lead-Free Status | — | Contains Lead |