M1AFS1500-1FG676I vs M1AFS1500-2FG676I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS1500-1FG676I sa pamamagitan ng Microchip Technology at M1AFS1500-2FG676I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS1500-1FG676I - Fusion FPGA 1.5M Gates 676FBGA | Microchip
M1AFS1500-1FG676I ✓ NakahandaMicrochip Technology
M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip
M1AFS1500-2FG676I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M1AFS1500-1FG676I | M1AFS1500-2FG676I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer Part Number | M1AFS1500-1FG676I | — |
| Manufacturer | Microchip Technology (Microsemi) | — |
| Product Type | Fusion Mixed-Signal FPGA | — |
| Number of Gates | 1.5 M | — |
| Number of I/O | 252 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Speed Grade | -1 | 2 |
| Packhaging / Kaso | 676-Pin FBGA | — |
| Style ng Pagpapasok | SMD/SMT | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | 3 (168 Hours) | — |
| Peak Reflow Time | 30 s | — |
| Packaging | Tray | — |
| Tindminan RoHS | RoHS Non-Compliant | RoHS Non-Compliant (contains lead) |
| Lead Free Status | Contains Lead | Contains Lead |
| Family | — | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | — | 1.5 M |
| Packhaging | — | 676-ball FBGA (FG676) |
| Uri ng Pagpapasok | — | Surface Mount |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| Hanay ng Temperature na Operasyon | — | Industrial (I suffix) -40C to +100C |
| Embedded Analog Features | — | On-chip ADC, clock conditioning circuit (CCC), power-on reset |
| External Configuration Device | — | Not required |
| Packaging Method | — | Tray |
| Number of User I/O | — | [DATA_NEEDED: Number of User I/O] |
| Embedded SRAM | — | [DATA_NEEDED: Embedded SRAM capacity] |
| DLL/PLL Blocks | — | [DATA_NEEDED: Number of CCC blocks] |