M1AFS1500-2FG676 vs M1AFS1500-2FG676I Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS1500-2FG676 sa pamamagitan ng Microchip Technology at M1AFS1500-2FG676I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
M1AFS1500-2FG676 M1AFS1500-2FG676 - 1.5M Gate Fusion FPGA | Microchip

M1AFS1500-2FG676 - 1.5M Gate Fusion FPGA | Microchip

M1AFS1500-2FG676 ✓ Nakahanda
Microchip Technology
M1AFS1500-2FG676I M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro M1AFS1500-2FG676 M1AFS1500-2FG676I
Brand Microchip Technology Microchip Technology
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
FPGA Family Fusion —
Total Gates 1,500,000 —
Number of Logic Cells 38,400 —
Number of User I/O 252 [DATA_NEEDED: Number of User I/O]
Maksimum na Taktiko ng Oras 350 MHz —
Core Supply Voltage 1.5 V 1.5 V
Process Technology 130 nm 130 nm CMOS
Packhaging / Kaso 676-FBGA (PBGA-676) —
Uri ng Pagpapasok Surface Mount Surface Mount
Hanay ng Temperature na Operasyon 0°C to 85°C (TJ) Industrial (I suffix) -40C to +100C
Packaging Tray —
Base Product Number M1AFS1500 —
Datasheet User Reference Manual 331 pages —
Speed Grade -2 2
RAM Bits [DATA_NEEDED: RAM Bits] —
Number of Embedded Analog Blocks [DATA_NEEDED: Number of Embedded Analog Blocks] —
Number of I/O Banks [DATA_NEEDED: Number of I/O Banks] —
Family — Fusion (Mixed-Signal Flash FPGA)
System Gates — 1.5 M
Packhaging — 676-ball FBGA (FG676)
Configuration Memory — On-chip flash (non-volatile, instant-on)
Embedded Analog Features — On-chip ADC, clock conditioning circuit (CCC), power-on reset
External Configuration Device — Not required
Tindminan RoHS — RoHS Non-Compliant (contains lead)
Lead Free Status — Contains Lead
Packaging Method — Tray
Embedded SRAM — [DATA_NEEDED: Embedded SRAM capacity]
DLL/PLL Blocks — [DATA_NEEDED: Number of CCC blocks]

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