M1AFS1500-2FGG256 vs M1AFS1500-1FGG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS1500-2FGG256 sa pamamagitan ng Microchip Technology at M1AFS1500-1FGG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
M1AFS1500-2FGG256 ✓ NakahandaMicrochip Technology
M1AFS1500-1FGG256I - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS1500-1FGG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M1AFS1500-2FGG256 | M1AFS1500-1FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | M1AFS1500 (Fusion) | — |
| System Gates | 1,500,000 | 1.5 million |
| Logic Cells | 38,400 | 38400 |
| Embedded Processor | ARM Cortex-M1 | — |
| Maksimum na Taktiko ng Oras | 350 MHz | — |
| Number of I/O | 119 | — |
| Supply Voltage na Operasyon | 1.5 V | — |
| Flash Memory Bits (reported) | 276480 | — |
| Technology | CMOS, 130nm class | — |
| Speed Grade | -2 | -1 (standard) |
| Packhaging / Kaso | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Style ng Pagpapasok | SMD/SMT | — |
| Hanay ng Temperature na Operasyon | 0C to +70C | — |
| Analog Blocks | Configurable analog (Fusion mixed-signal architecture) | — |
| Programming Type | Flash-based (in-system programmable) | — |
| Packaging | Tray | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Total RAM Blocks | [DATA_NEEDED: RAM block count] | — |
| Family | — | Fusion (M1 series, mixed-signal FPGA) |
| Processor Core | — | ARM Cortex-M1 (soft core in fabric) |
| User I/O | — | 119 |
| Flash Configuration Memory | — | 276480 bits |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm flash-based |
| Packhaging | — | 256-LBGA (FBGA), 17x17 mm, 1.0 mm ball pitch |
| Temperature na Operasyon | — | -40C to +85C (industrial, I suffix) |
| Configuration Type | — | Flash-based, instant-on, single chip |
| Security | — | 128-bit flash lock, AES decryption |
| Analog Features | — | Configurable analog blocks (mixed-signal) |
| Clock Management | — | Integrated CCC (clock conditioning circuits) |
| Uri ng Pagpapasok | — | Surface Mount |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |