M1AFS1500-FGG676 vs M1AFS1500-1FGG676 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS1500-FGG676 sa pamamagitan ng Microchip Technology at M1AFS1500-1FGG676 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS1500-FGG676 - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS1500-FGG676 ✓ NakahandaMicrochip Technology
M1AFS1500-1FGG676 - Fusion FPGA 1.5M Gates 676-FBGA | Microchip
M1AFS1500-1FGG676 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M1AFS1500-FGG676 | M1AFS1500-1FGG676 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Fusion (M1 Fusion mixed-signal FPGA) | — |
| Equivalent Gates | 1,500,000 gates | — |
| Logic Cells | 38,400 | — |
| User I/O | 252 | — |
| Max Clock Frequency | 350 MHz | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V |
| Process Technology | 130 nm CMOS | — |
| Configuration Technology | Flash-based (instant-on, live at power-up) | — |
| Security | 128-bit flash lock, AES decryption | — |
| Analog Capability | Configurable analog blocks, voltage/temperature monitoring | — |
| Soft CPU Support | ARM Cortex-M1, MicroBlade | — |
| Packhaging | 676-ball FBGA (FGG676) | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Packaging | Tray | Tray |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | unknown |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Embedded Memory | Large flash memory blocks integrated | — |
| Manufacturer Part Number | — | M1AFS1500-1FGG676 |
| Series | — | M1AFS1500 (Fusion) |
| Number of Equivalent Gates | — | 1,500,000 gates |
| Number of Logic Cells | — | 38,400 |
| Maksimum na Taktiko ng Oras | — | 350 MHz |
| Number of I/O | — | 252 I/O |
| Technology | — | 130 nm CMOS flash-based |
| Packhaging / Kaso | — | FBGA-676 (676-ball BGA, 1.00 mm ball pitch) |
| Style ng Pagpapasok | — | SMD/SMT |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +70 C |
| Speed Grade | — | -1 |
| Configuration Memory | — | Flash (non-volatile, live at power-up) |
| Analog Integration | — | Configurable analog blocks (mixed-signal Fusion architecture) |