M1AFS250-1FGG256I vs M1AFS250-1FG256I Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS250-1FGG256I sa pamamagitan ng Microchip Technology at M1AFS250-1FG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
M1AFS250-1FGG256I M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I ✓ Nakahanda
Microchip Technology
M1AFS250-1FG256I M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip

M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip

M1AFS250-1FG256I ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro M1AFS250-1FGG256I M1AFS250-1FG256I
Brand Microchip Technology Microchip Technology
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series M1AFS250 (Fusion) Fusion (M1 - with ARM Cortex-M1)
System Gates 250,000 gates 250000 gates
Logic Cells 6144 —
Total SRAM/Flip-Flop Bits (DigiKey listing) 36864 —
Number of I/O 114 —
Maximum System Frequency 350 MHz —
Processor Core ARM Cortex-M1 (optional ARM support, M1 variant) —
Technology 130-nm, 7-layer metal, flash-based CMOS —
Configuration Memory Nonvolatile flash (Live at Power-Up, LAPU) —
Security 128-bit flash-based lock, AES decryption —
Supply Voltage na Operasyon 1.5 V —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
Packhaging / Kaso 256-LBGA (FBGA), 1.00 mm ball pitch —
Style ng Pagpapasok SMD/SMT —
Packaging Tray —
Mixed-Signal Features Configurable analog, flash memory blocks, clock generation and management —
Tindminan RoHS [DATA_NEEDED: RoHS status] —
Moisture Sensitivity Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
D Flip-Flops (DFF) — 36864
Total I/O — 114
Core Supply Voltage — 1.5 V (1.425 V to 1.575 V)
Configuration Type — Flash-based (live at power-up)
Embedded Processor — ARM Cortex-M1 soft core
Analog Features — Configurable analog blocks, clock generation and management
On-chip Memory — Flash memory blocks
Temperature na Operasyon — -40C to +85C (industrial, suffix I)
Speed Grade — -1
Packhaging — 256-LBGA (FBGA)
Package Dimensions — 17 mm x 17 mm x 1.2 mm height
Uri ng Pagpapasok — Surface Mount
Supplier Device Package — 256-LBGA
Total RAM — [DATA_NEEDED: Total RAM bits]
Embedded Block RAM (eSRAM) — [DATA_NEEDED: eSRAM size]

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