M1AFS250-1FGG256I vs M1AFS250-1FG256I Karşılaştırma

Ayrıntılı yan yana karşılaştırma M1AFS250-1FGG256I tarafından Microchip Technology ve M1AFS250-1FG256I tarafından Microchip TechnologyAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

Microchip Technology
M1AFS250-1FGG256I M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I ✓ Aktif
Microchip Technology
M1AFS250-1FG256I M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip

M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip

M1AFS250-1FG256I ✓ Aktif

Özellik Karşılaştırması

Parametre M1AFS250-1FGG256I M1AFS250-1FG256I
Marka Microchip Technology Microchip Technology
Kategori FPGA & CPLD FPGA & CPLD
Yaşam Döngüsü Durumu Aktif Aktif
Series M1AFS250 (Fusion) Fusion (M1 - with ARM Cortex-M1)
System Gates 250,000 gates 250000 gates
Logic Cells 6144 —
Total SRAM/Flip-Flop Bits (DigiKey listing) 36864 —
Number of I/O 114 —
Maximum System Frequency 350 MHz —
Processor Core ARM Cortex-M1 (optional ARM support, M1 variant) —
Technology 130-nm, 7-layer metal, flash-based CMOS —
Configuration Memory Nonvolatile flash (Live at Power-Up, LAPU) —
Security 128-bit flash-based lock, AES decryption —
İşletim Besleme Gerilimi 1.5 V —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
Paket / Kas 256-LBGA (FBGA), 1.00 mm ball pitch —
Montaj Stili SMD/SMT —
Packaging Tray —
Mixed-Signal Features Configurable analog, flash memory blocks, clock generation and management —
RoHS Durumu [DATA_NEEDED: RoHS status] —
Moisture Sensitivity Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
D Flip-Flops (DFF) — 36864
Total I/O — 114
Core Supply Voltage — 1.5 V (1.425 V to 1.575 V)
Configuration Type — Flash-based (live at power-up)
Embedded Processor — ARM Cortex-M1 soft core
Analog Features — Configurable analog blocks, clock generation and management
On-chip Memory — Flash memory blocks
İşletim Sıcaklığı — -40C to +85C (industrial, suffix I)
Speed Grade — -1
Paket — 256-LBGA (FBGA)
Package Dimensions — 17 mm x 17 mm x 1.2 mm height
Montaj Türü — Surface Mount
Supplier Device Package — 256-LBGA
Total RAM — [DATA_NEEDED: Total RAM bits]
Embedded Block RAM (eSRAM) — [DATA_NEEDED: eSRAM size]

Dökümanlar & Kaynaklar

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