M1AFS250-1FGG256I vs M1AFS250-2FG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS250-1FGG256I sa pamamagitan ng Microchip Technology at M1AFS250-2FG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ NakahandaMicrochip Technology
M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip
M1AFS250-2FG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M1AFS250-1FGG256I | M1AFS250-2FG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | M1AFS250 (Fusion) | — |
| System Gates | 250,000 gates | 250K |
| Logic Cells | 6144 | — |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | 36864 | — |
| Number of I/O | 114 | — |
| Maximum System Frequency | 350 MHz | — |
| Processor Core | ARM Cortex-M1 (optional ARM support, M1 variant) | ARM Cortex-M1 (hard IP) |
| Technology | 130-nm, 7-layer metal, flash-based CMOS | — |
| Configuration Memory | Nonvolatile flash (Live at Power-Up, LAPU) | Flash-based, nonvolatile |
| Security | 128-bit flash-based lock, AES decryption | — |
| Supply Voltage na Operasyon | 1.5 V | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Packhaging / Kaso | 256-LBGA (FBGA), 1.00 mm ball pitch | — |
| Style ng Pagpapasok | SMD/SMT | — |
| Packaging | Tray | Tray |
| Mixed-Signal Features | Configurable analog, flash memory blocks, clock generation and management | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | RoHS Non-Compliant (contains lead; FGG variant is lead-free) |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Family | — | Fusion (M1AFS, ARM Cortex-M1 support) |
| User I/O | — | 114 |
| Embedded RAM Bits | — | 36864 |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm, 7-layer metal flash-based CMOS |
| System Performance | — | 350 MHz |
| Power-Up Mode | — | Live at Power-Up (LAPU) |
| Analog Block | — | Configurable analog (voltage, current, temperature monitoring) |
| Packhaging | — | 256-ball FBGA (256-LBGA) |
| Speed Grade | — | -2 |
| Temperature Range | — | Industrial (-40C to +85C) |
| Uri ng Pagpapasok | — | Surface Mount |