M1AFS250-1FGG256I vs M1AFS250-2FG256I 比較

詳細並排比較 M1AFS250-1FGG256I 由 Microchip Technology 與 M1AFS250-2FG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
M1AFS250-1FGG256I M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I ✓ 啟用中
Microchip Technology
M1AFS250-2FG256I M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip

M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip

M1AFS250-2FG256I ✓ 啟用中

規格比較

參數 M1AFS250-1FGG256I M1AFS250-2FG256I
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series M1AFS250 (Fusion) —
System Gates 250,000 gates 250K
Logic Cells 6144 —
Total SRAM/Flip-Flop Bits (DigiKey listing) 36864 —
Number of I/O 114 —
Maximum System Frequency 350 MHz —
Processor Core ARM Cortex-M1 (optional ARM support, M1 variant) ARM Cortex-M1 (hard IP)
Technology 130-nm, 7-layer metal, flash-based CMOS —
Configuration Memory Nonvolatile flash (Live at Power-Up, LAPU) Flash-based, nonvolatile
Security 128-bit flash-based lock, AES decryption —
工作電源電壓 1.5 V —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
封裝 / 外殼 256-LBGA (FBGA), 1.00 mm ball pitch —
安裝方式 SMD/SMT —
Packaging Tray Tray
Mixed-Signal Features Configurable analog, flash memory blocks, clock generation and management —
RoHS 狀態 [DATA_NEEDED: RoHS status] RoHS Non-Compliant (contains lead; FGG variant is lead-free)
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
Family — Fusion (M1AFS, ARM Cortex-M1 support)
User I/O — 114
Embedded RAM Bits — 36864
Core Supply Voltage — 1.5 V
Process Technology — 130 nm, 7-layer metal flash-based CMOS
System Performance — 350 MHz
Power-Up Mode — Live at Power-Up (LAPU)
Analog Block — Configurable analog (voltage, current, temperature monitoring)
封裝 — 256-ball FBGA (256-LBGA)
Speed Grade — -2
Temperature Range — Industrial (-40C to +85C)
安裝類型 — Surface Mount

資料表與資源

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