M1AFS250-FGG256I vs A3PE600-FGG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS250-FGG256I sa pamamagitan ng Microchip Technology at A3PE600-FGG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS250-FGG256I - 250K Gate Fusion FPGA 114 I/O | Microchip
M1AFS250-FGG256I ✓ NakahandaMicrochip Technology
A3PE600-FGG256I - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M1AFS250-FGG256I | A3PE600-FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Fusion (M1AFS) | — |
| System Gates | 250K | 600000 gates |
| D Flip-Flops / Registers | 36864 | — |
| User I/O | 114 | 165 |
| Embedded Processor | ARM Cortex-M1 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Fabric Speed Metric | 1.0989 GHz (per distributor listing) | — |
| Process Technology | 130 nm flash-based | CMOS flash FPGA |
| Configuration Memory | On-chip flash (non-volatile) | On-chip Flash (non-volatile, single-chip) |
| Packhaging | 256-LBGA (FGG256) | 256-FBGA (S-PBGA-B256), 17 x 17 mm |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Tindminan RoHS | Compliant | Compliant (lead free) |
| Packaging | Tray | — |
| Family | — | ProASIC3E Flash FPGA |
| Logic Elements (VersaTiles) | — | 13824 |
| Embedded Flash Memory | — | 110592 bits |
| Maximum Internal Performance | — | 350 MHz |
| Package Height | — | 1.6 mm |
| Footprint Compatibility | — | FG256 and FG484 footprint-compatible packages |