M1AFS250-FGG256I vs M1AFS250-1FGG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS250-FGG256I sa pamamagitan ng Microchip Technology at M1AFS250-1FGG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS250-FGG256I - 250K Gate Fusion FPGA 114 I/O | Microchip
M1AFS250-FGG256I ✓ NakahandaMicrochip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M1AFS250-FGG256I | M1AFS250-1FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Fusion (M1AFS) | M1AFS250 (Fusion) |
| System Gates | 250K | 250,000 gates |
| D Flip-Flops / Registers | 36864 | — |
| User I/O | 114 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Core Supply Voltage | 1.5 V | — |
| Fabric Speed Metric | 1.0989 GHz (per distributor listing) | — |
| Process Technology | 130 nm flash-based | — |
| Configuration Memory | On-chip flash (non-volatile) | Nonvolatile flash (Live at Power-Up, LAPU) |
| Packhaging | 256-LBGA (FGG256) | — |
| Ball Pitch | 1.0 mm | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | -40C to +85C (Industrial) | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Packaging | Tray | Tray |
| Logic Cells | — | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | — | 36864 |
| Number of I/O | — | 114 |
| Maximum System Frequency | — | 350 MHz |
| Processor Core | — | ARM Cortex-M1 (optional ARM support, M1 variant) |
| Technology | — | 130-nm, 7-layer metal, flash-based CMOS |
| Security | — | 128-bit flash-based lock, AES decryption |
| Supply Voltage na Operasyon | — | 1.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Packhaging / Kaso | — | 256-LBGA (FBGA), 1.00 mm ball pitch |
| Style ng Pagpapasok | — | SMD/SMT |
| Mixed-Signal Features | — | Configurable analog, flash memory blocks, clock generation and management |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |