M1AFS600-1FGG484K vs AFS600-FG484 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS600-1FGG484K sa pamamagitan ng Microchip Technology at AFS600-FG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Microchip Technology
M1AFS600-1FGG484K M1AFS600-1FGG484K - Fusion FPGA 600K Gates 484-BGA | Microchip

M1AFS600-1FGG484K - Fusion FPGA 600K Gates 484-BGA | Microchip

M1AFS600-1FGG484K ✓ Nakahanda
Microchip Technology
AFS600-FG484 AFS600-FG484 - 600K Mixed-Signal FPGA | Microchip

AFS600-FG484 - 600K Mixed-Signal FPGA | Microchip

AFS600-FG484 ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro M1AFS600-1FGG484K AFS600-FG484
Brand Microchip Technology Microchip Technology
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Fusion (M1 series) —
System Gates 600K —
Logic Elements [DATA_NEEDED: logic element count] —
Total Flash Configuration Bits 110592 —
User I/O 172 172 I/O
Embedded Processor ARM Cortex-M1 (M1 variant) —
Technology 130 nm flash-based CMOS Advanced 130 nm, 7-layer metal, flash-based CMOS
Core Voltage 1.5 V —
Packhaging 484-pin FBGA (FGG484) 484-ball PBGA
Uri ng Pagpapasok Surface Mount —
Max Frequency 1282.05 MHz (family reference) —
Configuration Memory On-chip flash (single-chip, instant-on) Embedded nonvolatile flash
Analog Peripherals Configurable analog blocks (Fusion architecture) —
Clock Management Integrated clock generation and management circuitry —
Speed Grade -1 —
Temperature na Operasyon [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Packaging Option Tray (K suffix) —
Tindminan RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Device Type — Fusion mixed-signal FPGA
Equivalent Gate Count — 600,000 gates
Logic Cells — 13,824 logic cells in related 600K-package variants
Package Dimensions — 23.00 mm x 23.00 mm in related 600K-package variants
Package Ball Pitch — 1.00 mm
Power-Up Configuration — Live at power-up in applicable Fusion devices
Programmable Resources — Configurable analog, programmable logic, embedded flash, and clock management
Processor Support — Optional ARM support in the Fusion family
Product Family — Fusion mixed-signal FPGAs
Manufacturer — Microchip Technology
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]
Lead-Free Status — [DATA_NEEDED: lead-free status]
Halogen-Free Status — [DATA_NEEDED: halogen-free status]
Volte ng Pagbibigay — [DATA_NEEDED: supply voltage range]

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita