M29F400FB55M3F2 vs M29F800FB55M3F2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M29F400FB55M3F2 sa pamamagitan ng Micron Technology at M29F800FB55M3F2 sa pamamagitan ng Micron Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Micron Technology
M29F800FB55M3F2 - 8Mbit 5V 55ns NOR Flash SO44 | Micron
M29F800FB55M3F2 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M29F400FB55M3F2 | M29F800FB55M3F2 |
|---|---|---|
| Brand | Micron Technology | Micron Technology |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | NOR Flash, Parallel | NOR Flash, Parallel |
| Density | 4194 kbits (4 Mbit) | 8389 kbits (8 Mbit) |
| Organisasyon | 512K x 8 / 256K x 16 | 512K x 16-bit / 1M x 8-bit |
| Access Time | 55 ns | 55 ns |
| Supply Voltage (VCC) | 5 V | 5 V |
| Boot Block Position | Bottom boot block | — |
| Temperature na Operasyon | -40C to +125C | -40C to +125C |
| Grade | Automotive (Auto Grade, 125C) | — |
| Package Type | 44-pin SO (SOP), wide body | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Programming | Embedded byte/word program algorithm | Embedded byte/word program algorithms |
| Erase | Embedded program/erase controller, block erase | — |
| Packaging | Tape and Reel (TR) | — |
| Tindminan RoHS | RoHS-compliant package (F2 suffix) | [DATA_NEEDED: RoHS status] |
| Bus Width | 8-bit or 16-bit (selectable) | — |
| Bilang ng Pins | 44 | — |
| Number of Words | — | 512 k |
| Bits per Word | — | 16 bits |
| Boot Block Type | — | Bottom Boot Block |
| Interface | — | Parallel, Asynchronous |
| OTP Area | — | 64 byte |
| Automotive Qualification | — | Auto Grade 3 (temperature grade 3, +125C) |
| Packhaging | — | 44-pin SO (SOIC-44) |
| Packing | — | Tape & Reel (T/R) |
| Endurance | — | [DATA_NEEDED: program/erase endurance cycles] |