M7AFS600-1FG484I vs M7AFS600-FG484I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M7AFS600-1FG484I sa pamamagitan ng Microchip Technology at M7AFS600-FG484I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip
M7AFS600-1FG484I ✓ NakahandaMicrochip Technology
M7AFS600-FG484I - 600K-Gate Fusion Mixed-Signal FPGA | Microchip
M7AFS600-FG484I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M7AFS600-1FG484I | M7AFS600-FG484I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| System Gates | 600000 | 600K |
| Programmable Logic Tiles | 110592 | — |
| User I/O | 172 | 172 |
| Family | Fusion (Flash FPGA with optional ARM CoreMP7 support) | Fusion (Mixed-Signal FPGA) |
| Process Technology | 130 nm, 7-layer metal, Flash-based CMOS | 130 nm |
| Configuration Memory | Nonvolatile Flash, retains program when powered off | — |
| Power-Up Feature | Live at Power-Up (LAPU) | — |
| Supply Voltage (Core) | 1.5 V | — |
| Logic Family | CMOS | — |
| Speed Grade | 1 | — |
| Packhaging | 484-ball FBGA (FG484), 23 x 23 x 2.44 mm | 484-Ball FBGA (FG484) |
| Ball Pitch | 1.0 mm | — |
| Temperature na Operasyon | Industrial, -40C to +85C | [DATA_NEEDED: operating temperature range] |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Embedded Processor Support | ARM CoreMP7 | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Maximum Operating Frequency | — | 1098.9 MHz |
| Embedded Flash (Configuration/System) | — | 110592 bits |
| Core Supply Voltage | — | 1.5 V |
| Processor Support | — | ARM CoreMP7 |
| Configuration Type | — | Flash-based (live at power-up) |
| Analog Peripherals | — | Yes (mixed-signal front end) |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |
| Packaging | — | Tray |
| Katayuan ng Lifecycle | — | Active (per Microchip/Microsemi product lines) |