M7AFS600-1FGG484I vs M7AFS600-2FG484I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M7AFS600-1FGG484I sa pamamagitan ng Microchip Technology at M7AFS600-2FG484I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M7AFS600-1FGG484I - 600K Gate Fusion FPGA, 172 I/O | Microchip
M7AFS600-1FGG484I ✓ NakahandaMicrochip Technology
M7AFS600-2FG484I - 600K Gate Flash FPGA, 172 I/O | Microchip
M7AFS600-2FG484I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M7AFS600-1FGG484I | M7AFS600-2FG484I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Fusion (M7AFS600) | — |
| System Gates | 600000 | 600000 gates |
| Number of I/Os | 172 | — |
| Total RAM Bits | 110592 | — |
| Embedded Processor | ARM CoreMP7 | — |
| Volte ng Pagbibigay | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Maximum Operating Frequency | 1282.05 MHz | — |
| Process Technology | 130 nm | 130 nm, 7-layer metal flash-based CMOS |
| Speed Grade | 1 (M7, fastest family grade) | -2 |
| Temperature na Operasyon | -40C to +85C | 0 to 70 C |
| Packhaging / Kaso | 484-BGA (FBGA) | — |
| Supplier Device Package | 484-FPBGA (23x23) | — |
| Style ng Pagpapasok | SMD/SMT | — |
| Packaging | Tray | Tray |
| Programmable Type | Flash-based, In-System Programmable | — |
| Tindminan RoHS | ROHS3 Compliant | — |
| Manufacturer Lead Time | 16 weeks | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Number of Logic Cells | [DATA_NEEDED: logic cell count] | — |
| Family | — | Fusion (Flash-Based FPGA) |
| Logic Elements (D Flip-Flops) | — | 110592 |
| User I/O | — | 172 |
| Core Supply Voltage | — | 1.5 V |
| Configuration Memory | — | Nonvolatile on-chip flash (retains program when powered off) |
| Live at Power-Up (LAPU) | — | Yes |
| Optional Processor Support | — | ARM CoreMP7 |
| Temperature Grade | — | Industrial (I suffix) |
| Packhaging | — | 484-ball FBGA, 1.0 mm pitch |
| Uri ng Pagpapasok | — | Surface Mount |
| Logic Family | — | CMOS |