M7AFS600-FGG256I vs AFS600-2FG256 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M7AFS600-FGG256I sa pamamagitan ng Microchip Technology at AFS600-2FG256 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ NakahandaMicrochip Technology
AFS600-2FG256 600K-Gate Mixed-Signal FPGA | Microchip
AFS600-2FG256 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M7AFS600-FGG256I | AFS600-2FG256 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Fusion Mixed-Signal FPGA | — |
| System Gates | 600K | 600000 gates |
| User I/O | 119 | — |
| Packhaging | 256-LBGA (FBGA), 1 mm ball pitch | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm flash-based CMOS |
| Maximum System Frequency | 1098.9 MHz (per distributor parametric listing) | — |
| Embedded Processor | ARM CoreMP7 | — |
| Fabric Type | Flash-based, non-volatile, instant-on | — |
| Analog Subsystem | Integrated configurable analog (per Microchip Fusion family page) | — |
| On-chip Flash Memory | Yes (large flash memory blocks, per Microchip Fusion family page) | — |
| Clock Management | Integrated clock generation and management circuitry (PLLs) | Comprehensive clock generation and management circuitry |
| Temperature Grade | Industrial (I suffix) | — |
| Hanay ng Temperature na Operasyon | -40C to +85C (industrial grade standard range) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Level ng MSL | [DATA_NEEDED: MSL Level] | — |
| Thermal Resistance (theta_JA) | [DATA_NEEDED: Thermal Resistance] | — |
| Programmable Logic Blocks | — | 13824 CLBs |
| Logic Family | — | CMOS |
| Metal Layers | — | 7 layers |
| Volte ng Pagbibigay | — | 1.5 V |
| Bilang ng Pins | — | 256 pins |
| I/O Count | — | 119 I/O |
| Package Type | — | FBGA-256, 1.0 mm pitch |
| Temperature na Operasyon | — | 0°C to 85°C (32°F to 185°F) |
| Junction Temperature Test | — | 100°C |
| Configuration Memory | — | Flash-based, nonvolatile |
| Power-Up Behavior | — | Live at Power-Up (LAPU) |
| Analog Resources | — | Configurable analog blocks |
| Embedded Memory | — | Large flash memory blocks |
| Product Family | — | Fusion mixed-signal FPGA |
| Tindminan RoHS | — | unknown |