MC68LK332ACAG16 vs MC68LK332GCAG16 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC68LK332ACAG16 sa pamamagitan ng NXP Semiconductors at MC68LK332GCAG16 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC68LK332ACAG16 - 32-Bit CPU32 MCU 16.78MHz | NXP | Industrial Control
MC68LK332ACAG16 ✗ Tapus ng BuhayNXP Semiconductors
MC68LK332GCAG16 - 32-Bit ColdFire MCU, ROMless, 144-LQFP | NXP
MC68LK332GCAG16 ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | MC68LK332ACAG16 | MC68LK332GCAG16 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Tapus ng Buhay | Tapus ng Buhay |
| Core Processor | CPU32 (M683xx) | — |
| Core Size | 32-Bit | — |
| Max Clock Frequency | 16.78 MHz | — |
| Program Memory Type | ROMless (external memory) | ROMless |
| RAM Size | 2 KB | 2 KB (2K x 8) |
| Peripherals | TPU, QSM (QSPI + SCI), SIM | — |
| Volte ng Pagbibigay | 5 V | 5 V |
| Temperature na Operasyon | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| Packhaging | 144-LQFP (20x20 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Connectivity | QSPI, SCI (UART) | — |
| Bus Architecture | Intermodule Bus (IMB) | — |
| External Bus Interface | External data/address bus for ROMless operation | — |
| Qualification | AEC-Q100 (per distributor listing) | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Katayuan ng Lifecycle | End of Life (per NXP product page) | — |
| Programmability | Not verified / Programmable (external code) | — |
| Core | — | CPU32 (M68300 / ColdFire lineage) |
| Width ng Data Bus | — | 32-bit |
| Maksimum na Taktiko ng Oras | — | 16.78 MHz |
| Number of I/O Lines | — | 15 |
| Oscillator Type | — | Internal |
| Packhaging / Kaso | — | 144-LQFP (20 x 20 mm) |
| Packaging | — | Tray |
| On-chip Peripherals | — | TPU (Time Processing Unit), QSM (Queued Serial Module), SIM (System Integration Module) |
| Interconnect Bus | — | IMB (Intermodule Bus) |