MC9S08AC16MBE vs MC9S08DV16MLF Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MC9S08AC16MBE sa pamamagitan ng NXP Semiconductors at MC9S08DV16MLF sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MC9S08AC16MBE MC9S08AC16MBE - 8-Bit 40MHz HCS08 MCU 16KB Flash | NXP

MC9S08AC16MBE - 8-Bit 40MHz HCS08 MCU 16KB Flash | NXP

MC9S08AC16MBE ✓ Nakahanda
NXP Semiconductors
MC9S08DV16MLF MC9S08DV16MLF - 8-Bit S08 MCU 16KB Flash 48-LQFP | NXP

MC9S08DV16MLF - 8-Bit S08 MCU 16KB Flash 48-LQFP | NXP

MC9S08DV16MLF Obsolete

Pagsanggunian na paghahambing

Parametro MC9S08AC16MBE MC9S08DV16MLF
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Aktibo Obsolete
Core HCS08 (8-bit CISC) —
CPU Clock Speed 40 MHz (20 MHz internal bus) —
Program Memory (Flash) 16 KB (16K x 8) —
RAM 1 KB —
Volte ng Pagbibigay 2.7 V to 5.5 V —
I/O Pins 38 —
ADC 10-bit, 8-channel 16-channel, 12-bit, 2.5 us conversion
Communication Interfaces 2x SCI (UART), 1x SPI, 1x I2C —
Timers/PWM 2x TPM (up to 6 channels) —
Packhaging 42-pin SPDIP (DIP-42) —
Uri ng Pagpapasok Through-Hole (THT) Surface Mount
Temperature na Operasyon -40C to +85C (industrial) —
On-chip Debug Yes (BDC, single-wire) —
Internal Clock Source ICS with FLL (32 kHz reference) —
Tindminan RoHS Compliant (lead-free SPDIP) —
Series S08AC / Flexis —
Core Processor — S08
Core Size — 8-bit
Core Architecture — HCS08 / CISC
CPU Speed — 40 MHz (20 MHz bus)
Program Memory Size — 16 KB (16K x 8) FLASH
RAM Size — 1 KB (1K x 8)
EEPROM Size — [DATA_NEEDED: EEPROM size]
Number of I/O — 39
Packhaging / Kaso — 48-LQFP (7x7 mm)
Connectivity — CANbus, I2C, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Oscillator Type — External
Interrupt / Reset Sources — Up to 32
Supply Voltage na Operasyon — 3.3 V / 5 V
Temperature Grade — Automotive
Packaging — Tray
Instruction Set — HC08 (with BGND)
Compliance — RoHS compliant

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