MC9S08DV60AMLF vs S9S08DV16F2MLC Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC9S08DV60AMLF sa pamamagitan ng NXP Semiconductors at S9S08DV16F2MLC sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC9S08DV60AMLF - 8-Bit 40MHz CAN/LIN MCU 60KB Flash | NXP
MC9S08DV60AMLF ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | MC9S08DV60AMLF | S9S08DV16F2MLC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | S08 | S9S08DV16 |
| Core Processor | HCS08 (enhanced HC08 with BGND) | S08 (HCS08), 8-bit CISC |
| Core Size | 8-bit | 8-bit |
| Core Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | — |
| RAM Size | 3 KB | 2 KB |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Number of I/O | 53 GPIO + 1 input-only | — |
| Communication Interfaces | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master | — |
| ADC | 8-channel 10-bit (per datasheet family) | — |
| Timers | Multiple TPM (per datasheet family) | — |
| Packhaging | 48-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +125C | -40C to +125C |
| Tindminan RoHS | ROHS3 Compliant | [DATA_NEEDED: RoHS compliance status] |
| Debug Interface | Single-wire BDM | — |
| Maksimum na Taktiko ng Oras | — | 40 MHz |
| Flash Memory | — | 16 KB (16K x 8) |
| ADC Resolution | — | 12-bit |
| Automotive Qualification | — | AEC-Q100 qualified |
| Connectivity | — | CAN, Serial (per family datasheet) |
| Data Programmers | — | On-chip emulation / background debug (BDM) |
| Packaging | — | Tray |
| EEPROM | — | Embedded EEPROM emulation supported (family feature) |