MC9S12DB128MPVE vs MC9S12DJ128MPVE Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC9S12DB128MPVE sa pamamagitan ng NXP Semiconductors at MC9S12DJ128MPVE sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC9S12DB128MPVE - 16-Bit HCS12 MCU, 128KB Flash, 25MHz | NXP
MC9S12DB128MPVE ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MC9S12DB128MPVE | MC9S12DJ128MPVE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Core Architecture | HCS12 (CPU12), 16-bit | HCS12 (16-bit CISC) |
| Maximum CPU Clock | 25 MHz | 25 MHz (50 MHz internal bus via PLL, see datasheet) |
| Program Memory (FLASH) | 128 KB (128K x 8) | — |
| Data Memory (RAM) | 8 KB (8K x 8) | — |
| Number of I/O Pins | 91 | — |
| Oscillator Type | Internal | — |
| Packhaging / Kaso | 112-LQFP (20x20 mm) | — |
| Uri ng Pagpapasok | Surface Mount (Gull Wing) | Surface Mount |
| Terminal Form | GULL WING | — |
| Number of Terminals | 112 | — |
| Package Code | LQFP | — |
| Package Shape | SQUARE | — |
| Temperature Grade | AUTOMOTIVE | — |
| Packaging | Tray | — |
| Tindminan RoHS | Compliant | Compliant |
| Program Memory (Flash) | — | 128 KB (128K x 8) |
| RAM | — | 8 KB |
| EEPROM | — | 2 KB |
| Volte ng Pagbibigay | — | 2.35 V to 2.75 V (single 2.5V nominal) |
| Digital I/O Pins | — | 59 |
| ADC | — | 2x 8-channel, 10-bit |
| PWM Channels | — | 8 |
| SCI (UART) | — | 2 |
| SPI | — | 1 |
| I2C (Inter-IC Bus) | — | 1 |
| Packhaging | — | 112-LQFP (20x20 mm) |
| Temperature na Operasyon | — | -40C to +125C (automotive grade) |
| Level ng MSL | — | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |
| Debug Interface | — | BDM (Background Debug Mode) |