MC9S12DJ256MFUE vs MC9S12DT256MPVE Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC9S12DJ256MFUE sa pamamagitan ng NXP Semiconductors at MC9S12DT256MPVE sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE NrndPagsanggunian na paghahambing
| Parametro | MC9S12DJ256MFUE | MC9S12DT256MPVE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | NRND |
| Architecture | 16-bit HCS12 CISC | — |
| Maksimum na Taktiko ng Oras | 25 MHz | — |
| Flash Memory | 256 KB | — |
| RAM Memory | 12 KB | — |
| Data Bus | 16-bit | — |
| External Bus Narrow Mode | 8-bit | — |
| Volte ng Pagbibigay | 2.35 V to 2.75 V | 2.35 V to 2.75 V (regulated core) |
| ADC | 2 x 8-channel, 10-bit | 2 x 10-bit, 8 channels each (16 channels total) |
| PWM | 8-channel | — |
| Enhanced Capture Timer | 8-channel | — |
| Asynchronous Serial Communication Interfaces | 2 | — |
| Digital I/O Lines | 20 discrete lines | — |
| Total I/O Ports | 59 | — |
| Packhaging | 80-pin PQFP, 14 mm x 14 mm | 112-LQFP (20x20 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | -40C to +125C (automotive grade) |
| AEC-Q100 Qualification | Qualified | — |
| Katayuan ng Lifecycle | NRND | NRND (Not Recommended for New Designs) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Core | — | HCS12 (16-bit CISC) |
| Maximum CPU Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 256 KB |
| RAM | — | 12 KB |
| EEPROM | — | 4 KB |
| Width ng Data Bus | — | 16-bit |
| I/O Pins | — | 91 |
| Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Communication Interfaces | — | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) |
| Debug Interface | — | Background Debug Mode (BDM) + JTAG |