MCF5272CVM66 vs MCF5232CVM100 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MCF5272CVM66 sa pamamagitan ng NXP Semiconductors at MCF5232CVM100 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MCF5272CVM66 - 32-Bit ColdFire V2 MPU, 66MHz, 196-LBGA | NXP
MCF5272CVM66 ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | MCF5272CVM66 | MCF5232CVM100 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Tapus ng Buhay | NRND |
| Core | ColdFire V2 | — |
| Width ng Data Bus | 32 bit | — |
| Maksimum na Taktiko ng Oras | 66 MHz | — |
| Performance | 63 MIPS (Dhrystone) | 125 Dhrystone 2.1 MIPS |
| Program Memory Size | 16 KB (4K x 32) ROM | — |
| RAM Size | 4 KB (1K x 32) | — |
| Number of I/O | 32 | — |
| Volte ng Pagbibigay | 3.3 V | 1.5V core / 3.3V I/O (typical) |
| Oscillator Type | External | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial) |
| Packhaging / Kaso | 196-LBGA (15x15 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Connectivity | 10/100 Ethernet MAC, USB 1.1 Device, I2C, UART | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Core Architecture | — | ColdFire V2 (32-bit RISC) |
| Core Frequency | — | 100 MHz |
| On-chip SRAM | — | 64 KB |
| On-chip Cache | — | 8 KB I-cache / 8 KB D-cache (configurable) |
| On-chip ROM | — | ROMless |
| Ethernet MAC | — | 10/100 Mbps (FEC) |
| Enhanced Timer (eTPU) | — | 16 channels |
| Encryption Accelerator | — | Hardware-accelerated (integrated) |
| DMA | — | 4-channel + external request/acknowledge |
| External Bus Interface | — | 32-bit (SRAM/ROM/Flash/DDR) |
| Packhaging | — | 196-LBGA (MAP-BGA) 15x15 mm |
| Katayuan ng Lifecycle | — | NRND (Not Recommended for New Designs) |