MPC8260AZUPIBB vs MPC8260AZUMHBB Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC8260AZUPIBB sa pamamagitan ng NXP Semiconductors at MPC8260AZUMHBB sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8260AZUPIBB - PowerPC G2 MPU 300MHz 480-TBGA | NXP
MPC8260AZUPIBB ⚠ Huling PagbiliNXP Semiconductors
MPC8260AZUMHBB - PowerQUICC II HIP4 266MHz MPU | NXP 480-TBGA
MPC8260AZUMHBB NrndPagsanggunian na paghahambing
| Parametro | MPC8260AZUPIBB | MPC8260AZUMHBB |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | PowerQUICC II | — |
| Core Processor | PowerPC G2 | — |
| Number of Cores | 1 | 1 |
| Bus Width | 32-bit | — |
| Width ng Data Bus | 64-bit (external memory bus) | 64-Bit |
| Core Speed | 300 MHz | — |
| Co-Processor / DSP | Communications; RISC CPM | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | None | — |
| Supply Voltage (Core) | 1.8 V | 1.8 V |
| Supply Voltage (I/O) | 3.3 V | 3.3 V |
| Process Technology | 0.25 um HiP4 | 0.25 µm CMOS |
| Packhaging | 480-TBGA (37.5 x 37.5 mm, 1.55 mm height, 1.27 mm pitch) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +105C (industrial) | [DATA_NEEDED: industrial/commercial junction range] |
| Tindminan RoHS | [DATA_NEEDED: RoHS status not stated in web snippets] | [DATA_NEEDED: per NXP product page] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale/Motorola) |
| Product Family | — | PowerQUICC II HIP4 (MPC82xx) |
| Architecture | — | RISC, PowerPC G2 |
| Core Clock Frequency | — | 266 MHz |
| Package Type | — | 480-TBGA (37.5 x 37.5 mm, 1.55 mm height, 1.27 mm pitch) |
| Peripherals | — | Communication Processor Module (CPM), PCI, Ethernet, ATM, HDLC |
| Silicon Revision | — | Rev B (HIP4) |
| Tray Packaging | — | Yes (per distributor listings) |