MPC8379VRALG vs MPC8377EVRALG Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MPC8379VRALG sa pamamagitan ng NXP Semiconductors at MPC8377EVRALG sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MPC8379VRALG MPC8379VRALG - PowerPC e300c4s MPU 667MHz 689-TEPBGA II | NXP

MPC8379VRALG - PowerPC e300c4s MPU 667MHz 689-TEPBGA II | NXP

MPC8379VRALG ✓ Nakahanda
NXP Semiconductors
MPC8377EVRALG MPC8377EVRALG - PowerQUICC II Pro MPU 667MHz e300c4s | NXP

MPC8377EVRALG - PowerQUICC II Pro MPU 667MHz e300c4s | NXP

MPC8377EVRALG ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro MPC8379VRALG MPC8377EVRALG
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Aktibo Aktibo
Manufacturer NXP Semiconductors NXP Semiconductors
Series MPC83xx PowerQUICC II Pro
Core Architecture PowerPC e300c4s PowerPC e300c4s
Number of Cores 1 —
Width ng Data Bus 32-bit 32-bit
Maximum Core Frequency 667 MHz 667 MHz
Supply Voltage na Operasyon 1.8 V / 2.5 V / 3.3 V —
Package Type 689-TEPBGA II —
Package Size 31 mm x 31 mm —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Memory Controller DDR1/DDR2 DDR1/DDR2, 32-bit with ECC
Ethernet Dual 10/100/1000 MAC —
PCI Express Yes (SERDES) 2 lanes (x1/x2)
USB USB 2.0 USB 2.0 High-Speed (host/device)
Local Bus 16/32-bit local bus 16-bit, up to 83 MHz
Encryption Enabled No (W/O ENCR) —
Temperature na Operasyon 0 C to +105 C [DATA_NEEDED: operating temperature range]
Tindminan RoHS [DATA_NEEDED: RoHS compliance from provided data] Compliant (lead-free, 'G' suffix)
Core Count — 1
L1 Cache (I/D) — 32 KB / 32 KB
L2 Cache — 256 KB unified
Operating Voltage (Core) — 1.0 V
Operating Voltage (I/O) — 3.3 V
Operating Voltage (DDR) — 1.8 V or 2.5 V
Ethernet MAC — Dual 10/100/1000 Mbps (SGMII/RGMII)
Security Engine — SEC 3.3 (DES/3DES/AES/SHA/RSA/ECC)
Packhaging — 689-TEPBGA II (31x31 mm), exposed pad
Level ng MSL — 3 (per JEDEC J-STD-020)

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