MPX2053DP vs MPX2010DP Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPX2053DP sa pamamagitan ng NXP Semiconductors at MPX2010DP sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPX2053DP - 50 kPa Differential Pressure Sensor | NXP | 4-SIP Module
MPX2053DP ✓ NakahandaNXP Semiconductors
MPX2010DP - 10 kPa Differential Pressure Sensor | NXP/STMicro
MPX2010DP ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MPX2053DP | MPX2010DP |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Pressure Sensors | Pressure Sensors |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Pressure Type | Differential | — |
| Operating Pressure Range | 0 kPa to 50 kPa (0 PSI to 7.25 PSI) | — |
| Sensitivity | 0.8 mV/kPa (typical) | — |
| Full-Scale Span (10 V supply) | 0 mV to 40 mV | — |
| Type ng Output | Analog voltage, ratiometric | Analog voltage, Wheatstone bridge (mV level) |
| Volte ng Pagbibigay | 10 V typical, 16 V maximum | 10 V DC typical (max 16 V) |
| Maximum Offset | ±1.0 mV | — |
| Response Time | 1.0 ms (typical) | 1.0 ms (typical) |
| Temperature na Operasyon | 0 °C to +85 °C | -40 °C to +125 °C |
| Port Configuration | Dual barbed ports, 0.19 in (4.93 mm) tube | Dual ports (differential), 0.19 inch / 4.93 mm tubes |
| Packhaging / Kaso | 4-SIP Module (Case 344-15) | — |
| Uri ng Pagpapasok | Through-hole, PCB mount | — |
| Technology | Silicon piezoresistive MEMS, on-chip temperature compensated | Piezoresistive (silicon strain gauge bridge) |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Type ng Sensor | — | Differential Pressure Sensor |
| Pressure Range | — | 0 to 10 kPa (0 to 1.45 PSI) |
| Typical Full-Scale Span | — | 25 mV at 10 V excitation |
| Zero Pressure Offset | — | 0 mV nominally (±1.0 mV max) |
| Linearity | — | ±0.05% (typ) |
| Temperature Compensation | — | 0 °C to +85 °C (on-chip) |
| Maximum Overpressure | — | 75 kPa |
| Burst Pressure | — | 200 kPa |
| Package / Mounting | — | 4-SIP Module (through-hole with axial tubes) |
| Media Compatibility | — | Dry air or non-corrosive gas |