MSC8157TAG1000A vs MSC8156ESAG1000B Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MSC8157TAG1000A sa pamamagitan ng NXP Semiconductors at MSC8156ESAG1000B sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP
MSC8157TAG1000A ⚠ Huling PagbiliNXP Semiconductors
MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors
MSC8156ESAG1000B ✗ Tapus ng BuhayPagsanggunian na paghahambing
| Parametro | MSC8157TAG1000A | MSC8156ESAG1000B |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | DSP | DSP |
| Katayuan ng Lifecycle | Huling Pagbili | Tapus ng Buhay |
| Device Type | Six-core Digital Signal Processor (DSP) | — |
| DSP Architecture | StarCore SC3850 (6x cores) | — |
| Core Frequency | 1 GHz per core | — |
| L1 Instruction Cache | 32 KB per core | — |
| L1 Data Cache | 32 KB per core | — |
| Unified L2 Cache | 512 KB (configurable as M2 in 64 KB increments) | — |
| Accelerator | MAPLE-B2 baseband accelerator | — |
| Memory Controller | Dual-channel DDR2/DDR3 with ECC | 64-bit DDR2/DDR3, up to 800 MT/s |
| High-Speed Serial I/O | 2x SRIO, 2x PCIe, 2x GbE, 2x CIPRI | — |
| Packhaging | 783-FCPBGA (29x29 mm) | 783-ball FCBGA (29x29 mm) |
| Ball Pitch | 1.0 mm | — |
| Temperature na Operasyon | -40C to +105C | 0C to +105C |
| Volte ng Pagbibigay | [DATA_NEEDED: core/IO voltage] | [DATA_NEEDED: core and I/O rail voltages] |
| MMU | Yes | — |
| Interrupt Controller | EPIC (Extended Programmable Interrupt Controller) | — |
| Timers | 2x 32-bit general-purpose per core | — |
| Tindminan RoHS | [DATA_NEEDED] | [DATA_NEEDED: RoHS compliance] |
| Level ng MSL | [DATA_NEEDED] | — |
| DSP Cores | — | 6x SC3850 StarCore cores |
| Core Clock Frequency | — | 1 GHz per core |
| Aggregate Performance | — | [DATA_NEEDED: aggregate MMACS rating] |
| Process Technology | — | 45 nm CMOS |
| Hardware Accelerator | — | MAPLE-B baseband accelerator (turbo decode) |
| SerDes Lanes | — | 2 lanes, SRIO or PCIe (selectable) |
| Ethernet | — | 1x Gigabit Ethernet MAC |
| Packet Engine | — | QUICC Engine subsystem |
| Security Engine | — | SEC 4.0 (Cryptographic accelerator) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Katayuan ng Lifecycle | — | End of Life (per NXP PCN) |