MSC8157TAG1000A vs MSC8156HAG1000B Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MSC8157TAG1000A sa pamamagitan ng NXP Semiconductors at MSC8156HAG1000B sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP
MSC8157TAG1000A ⚠ Huling PagbiliNXP Semiconductors
MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP
MSC8156HAG1000B ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MSC8157TAG1000A | MSC8156HAG1000B |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | DSP | DSP |
| Katayuan ng Lifecycle | Huling Pagbili | Aktibo |
| Device Type | Six-core Digital Signal Processor (DSP) | — |
| DSP Architecture | StarCore SC3850 (6x cores) | — |
| Core Frequency | 1 GHz per core | — |
| L1 Instruction Cache | 32 KB per core | — |
| L1 Data Cache | 32 KB per core | — |
| Unified L2 Cache | 512 KB (configurable as M2 in 64 KB increments) | — |
| Accelerator | MAPLE-B2 baseband accelerator | — |
| Memory Controller | Dual-channel DDR2/DDR3 with ECC | — |
| High-Speed Serial I/O | 2x SRIO, 2x PCIe, 2x GbE, 2x CIPRI | — |
| Packhaging | 783-FCPBGA (29x29 mm) | 783-ball FCBGA (FCP-BGA), 29 x 29 mm |
| Ball Pitch | 1.0 mm | — |
| Temperature na Operasyon | -40C to +105C | 0C to +105C |
| Volte ng Pagbibigay | [DATA_NEEDED: core/IO voltage] | — |
| MMU | Yes | — |
| Interrupt Controller | EPIC (Extended Programmable Interrupt Controller) | — |
| Timers | 2x 32-bit general-purpose per core | — |
| Tindminan RoHS | [DATA_NEEDED] | Compliant (per distributor datasheet listing) |
| Level ng MSL | [DATA_NEEDED] | [DATA_NEEDED: MSL rating] |
| Product Type | — | Multi-core Digital Signal Processor (DSP) |
| DSP Cores | — | 6 x StarCore SC3850 |
| Core Clock Frequency | — | 1 GHz per core |
| On-chip RAM | — | 576 KB (L1/L2 SRAM) |
| On-chip ROM | — | 96 KB |
| Hardware Accelerator | — | MAPLE-B (turbo/Viterbi FEC) |
| External Memory Interface | — | DDR2/DDR3 with ECC |
| High-speed Serial Fabric | — | 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2 |
| Ethernet | — | 2 x Gigabit Ethernet (SGMII/RGMII) |
| Queuing Engine | — | Yes (QE for packet/traffic management) |
| Peripheral Interfaces | — | SPI, I2C, UART, PCI |
| Process Technology | — | CMOS |
| Uri ng Pagpapasok | — | Surface Mount |
| Peak Reflow Temperature | — | 245C (JEDEC J-STD-020) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |