SAK-TC364DP-64F300F vs SAK-TC387QP-160F300S Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng SAK-TC364DP-64F300F sa pamamagitan ng Infineon at SAK-TC387QP-160F300S sa pamamagitan ng Infineon. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Infineon
SAK-TC364DP-64F300F - AURIX TC36x Dual-Core 300MHz MCU | Infineon
SAK-TC364DP-64F300F ✓ NakahandaInfineon
SAK-TC387QP-160F300S - 32-bit AURIX TC3xx Quad-Core MCU | Infineon
SAK-TC387QP-160F300S ✓ NakahandaPagsanggunian na paghahambing
| Parametro | SAK-TC364DP-64F300F | SAK-TC387QP-160F300S |
|---|---|---|
| Brand | Infineon | Infineon |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Core Architecture | TriCore v1.6.2 (32-bit) | Infineon TriCore TC1.6.2 (32-bit) |
| Number of Cores | 2 (1 main + 1 checker in lockstep) | 4 TriCore (2 lockstep checker cores included) |
| Maksimum na Taktiko ng Oras | 300 MHz | — |
| Program Flash | 4 MB | — |
| SRAM | 672 KB | — |
| Volte ng Pagbibigay | 3.3 V / 5 V (single-voltage operation) | [DATA_NEEDED: supply voltage range] |
| Functional Safety | ISO 26262 ASIL-D capable | ISO 26262 ASIL-D capable |
| Automotive Grade | AEC-Q100 qualified | — |
| Ethernet | 100 Mbit (MII/RMII) | 1 Gbit Ethernet |
| CAN-FD Ports | Multiple (per TC36xDP configuration) | — |
| LIN Channels | Multiple | — |
| Hardware Security Module | Yes (EVITA-Full) | — |
| Hardware ECC | Yes (Flash + RAM) | — |
| Integrated LDO | Yes | — |
| Typical Power Consumption | < 2 W | — |
| Packhaging | PG-LQFP-144-22 (TQFP-144) | PG-LFBGA-292-11 |
| Temperature na Operasyon | -40 C to +125 C (automotive Grade 1) | [DATA_NEEDED: operating temperature range] |
| Tindminan RoHS | Compliant | Compliant |
| Product Family | — | AURIX TC3xx (second generation) |
| Series | — | TC38xQP |
| CPU Frequency | — | 300 MHz |
| Program Memory (FLASH) | — | 10 MB (10M x 8) |
| Flash Technology | — | Embedded 40 nm |
| HSM | — | Integrated Hardware Security Module |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |