XC3S200-4FTG256I vs XC3S200A-4FTG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XC3S200-4FTG256I sa pamamagitan ng Xilinx at XC3S200A-4FTG256I sa pamamagitan ng Xilinx. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Xilinx
XC3S200A-4FTG256I - 200K Gate Spartan-3A FPGA, 195 I/O | AMD/Xilinx
XC3S200A-4FTG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | XC3S200-4FTG256I | XC3S200A-4FTG256I |
|---|---|---|
| Brand | Xilinx | Xilinx |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Spartan-3 | Spartan-3A |
| System Gates | 200,000 | 200,000 |
| Logic Cells | 4,320 | 4,032 |
| Slices | 2,160 | 1,792 |
| Block RAM | 216 Kbit (12 blocks x 18 Kbit) | 288 Kbits |
| Dedicated Multipliers | 4 (18x18) | — |
| DCM (Digital Clock Manager) | 4 | — |
| Maximum User I/O | 173 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | -4 | -4 |
| Process Technology | 90 nm | 90 nm CMOS |
| Packhaging | 256-ball FTBGA (FTG256), 17 x 17 mm | 256-ball FTBGA (FTG256), 17x17 mm, 1.0 mm pitch |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (industrial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Terminal Form | Ball | — |
| Peak Reflow Time | 30 s | — |
| Tindminan RoHS | Compliant (G suffix = lead-free) | Lead-free / RoHS compliant |
| Configurable Logic Blocks (CLBs) | — | 448 |
| Distributed RAM | — | 48 Kbits |
| User I/Os | — | 195 |
| Maximum Operating Frequency | — | 667 MHz |
| Multipliers (18x18) | — | 16 dedicated |
| DCMs | — | 4 |