XC6SLX16-3FTG256C vs XC6SLX16-2FTG256C Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX16-3FTG256C sa pamamagitan ng AMD at XC6SLX16-2FTG256C sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | XC6SLX16-3FTG256C | XC6SLX16-2FTG256C |
|---|---|---|
| Brand | AMD | AMD |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Katayuan ng Stock | — | In Stock |
| Presyo ng Yunit (USD) | — | $16.41 |
| Family | Spartan-6 LX | Spartan-6 LX |
| Series | XC6SLX16 | — |
| Logic Cells | 14,579 | 14,579 |
| Configurable Logic Blocks (CLBs) | 1139 | 1,139 |
| Distributed RAM | 256 kbit | — |
| Block RAM | [DATA_NEEDED: total Kbits] | — |
| DSP48A1 Slices | 32 | — |
| Maximum User I/Os | 186 | 186 |
| User I/O Banks | [DATA_NEEDED: count] | — |
| Number of CMTs | 2 | — |
| Process Technology | 45 nm CMOS | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Auxiliary Voltage (VCCAUX) | 2.5 V to 3.3 V | — |
| Speed Grade | -3 | -2 |
| Packhaging | 256-LBGA / FTBGA-256, 17 x 17 mm, 1.0 mm pitch | 256-ball Fine-Pitch Thin BGA (FTG256), 17×17 mm, 1.0 mm pitch |
| Temperature na Operasyon | 0 C to +85 C (Commercial) | 0 °C to +85 °C (Commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | — |
| Slices | — | 2,278 |
| Block RAM Bits | — | 589,824 bits |
| Block RAM Blocks (18 Kb) | — | 32 |
| DSP Slices (18×18 multipliers) | — | 32 |
| Maximum Single-Ended I/O Banks | — | 4 |
| Process Node | — | 45 nm CMOS, 9-metal layer |
| Supply Voltage (Core) | — | 1.2 V nominal |
| Lead-Free / RoHS | — | Yes (compliant) |
| Configuration Modes | — | JTAG, SPI (x1/x2/x4), BPI (x8/x16), Slave-Parallel |
| Clock Management Tiles (CMTs) | — | 2 (each with PLL + MMCM) |
| PCIe Support | — | Soft IP only (no integrated PCIe hard cores) |