XC6SLX75-2FGG484I vs XC6SLX45-2FGG484I Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX75-2FGG484I sa pamamagitan ng AMD at XC6SLX45-2FGG484I sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro XC6SLX75-2FGG484I XC6SLX45-2FGG484I
Brand AMD AMD
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Family Spartan-6 LX —
Logic Cells 74,637 43,661
Logic Elements / Slices 11,650 slices —
System Gates 3,170,304 —
Block RAM 4,824 Kbits (180 x 18 Kbit) 2,138,112 bits (2,088 Kb/s)
DSP Slices (DSP48A1) 132 58
User I/Os 280 —
Maximum Internal Frequency 667 MHz —
Process Technology 45 nm CMOS 45 nm low-power CMOS
Core Supply Voltage (VCCINT) 1.14 V to 1.26 V —
Auxiliary Supply Voltage (VCCAUX) 3.3 V —
Speed Grade -2 (mid-range) -2
Packhaging 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch 484-ball BGA (FBGA-484)
Operating Temperature (Industrial) -40 °C to +100 °C (junction to +125 °C) —
Uri ng Pagpapasok Surface Mount (BGA) —
Level ng MSL 3 (168 hours) —
Tindminan RoHS Compliant —
Family — Spartan-6 LX
Logic Slices — 6,822
Flip-Flops — 54,576
Maximum User I/O — 316
Package Dimensions — 23 x 23 mm, 1.0 mm ball pitch
Operating Temperature (I grade) — -40C to +100C (industrial)
Supply Voltage Core — 1.2 V typical
Clock Management Tiles — 6 CMT (4 DCM + 2 PLL)
Maximum I/O Speed — 800 Mbps LVDS
Memory Interface Support — DDR, DDR2, DDR3, LPDDR
Configuration Memory — AES-256 bitstream encryption
RoHS Compliance — Lead-free / RoHS compliant

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