Microchip Technology

DSPIC33EV128GM106-I/PT - 70 MIPS 5V 128KB ECC Flash DSC | Microchip

MPN: DSPIC33EV128GM106-I/PT ✓ Nakahanda
4.5 V to 5.5 V Vdss 64-pin TQFP (10x10 mm, 0.5 mm pitch) Package 70 MIPS Speed 128 KB (43K x 24), with ECC Memory
MOQ: 1 |

DSPIC33EV128GM106-I/PT Ulas

The Microchip Technology DSPIC33EV128GM106-I/PT is a 16-bit digital signal controller (DSC) featuring a 5V, 70 MIPS dsPIC33E CPU, 128KB of ECC Flash program memory (43K x 24) and 8KB of RAM, packaged in a 64-pin TQFP (10x10 mm, 0.5 mm pitch). It operates from a single 4.5V-5.5V supply and is qualified for the -40C to +125C industrial temperature range per the -I suffix.

A digital signal controller (DSC) is a hybrid device that combines the deterministic control architecture of a microcontroller with the deterministic math throughput of a digital signal processor. Within the power and signal-processing taxonomy, the DSC sits above general-purpose microcontrollers and below dedicated DSPs, occupying the niche where closed-loop control loops (motor control, power conversion, sensor fusion) benefit from hardware multiply-accumulate (MAC) and barrel-shifter instructions on a 16-bit datapath. The dsPIC33EV family in particular targets robust 5V operation with ECC Flash for functional-safety use cases.

Key features include execution at up to 70 MIPS from a 5V rail, hardware CAN, 4 DMA channels, 7 timers, and dedicated motor-control PWM peripherals. The 128KB of ECC Flash provides single-bit error correction and dual-bit error detection, which is essential for automotive and industrial functional-safety designs governed by IEC 61508 and ISO 26262. A 16-channel 12-bit ADC, op-amp comparators and a 5 ns comparator complete the analog front end.

The dsPIC33E core implements a Harvard architecture with a 16-bit instruction word and DSP-aware extensions, including a single-cycle MAC and a 40-bit accumulator, allowing fractional DSP arithmetic alongside integer MCU operations. Peripheral Pin Select (PPS) provides extensive I/O remapping flexibility, freeing the designer from rigid pin-function assignments.

Typical applications include automotive sensor and touch-control units, industrial motor drives with CAN networking, appliance controllers in high-electrical-noise mains environments, and functional-safety subsystems where ECC Flash and self-test libraries reduce external watchdog complexity. The 5V-tolerant design minimizes level-shifting when interfacing to legacy 5V sensors.

Design consideration: connect all VDD/VSS pin pairs and use any matched PGECx/PGEDx pair consistently for ICSP programming and debugging, because Microchip's programming guidelines require the clock and data pins to come from the same pair. Decouple each VDD with a 0.1 uF ceramic plus a bulk tantalum placed within 5 mm of the pin.

This page synthesizes distributor pricing context, drop-in family alternatives, and practical design notes not consolidated in the manufacturer datasheet.

Mga alternatibo na pwedeng ilagay na DSPIC33EV128GM106-I/PT — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.

Variante sa Seri na ito

Katulad na modelo sa serye na katugma sa pagpasok DSPIC33EV128GM106-I/PT (parehas na form factor at footprint) — pagkakaiba sa Package, Core Architecture, Operating Temperature Range, Timers, Maximum CPU Speed.

Microchip Technology
Package: 64-TQFP (10x10 mm), 0.50 mm terminal pitch
Operating Temperature Range: -40C to +125C (E grade)
Microchip Technology
Package: 64-TQFP (10x10 mm), 0.5 mm pitch
Core Architecture: 16-bit dsPIC33E DSC core
Timers: 9
Microchip Technology
Package: 64-pin TQFP (10x10 mm)
Operating Temperature Range: -40 C to +85 C (Industrial, -I suffix)
Timers: 9 (16-bit)
Microchip Technology
Core Architecture: dsPIC33 DSC, 16-bit modified Harvard
Operating Temperature Range: -40C to +85C (I-grade)
Maximum CPU Speed: 70 MIPS (40 MHz core clock)

DSPIC33EV128GM106-E/PT

✅ Drop-In
Microchip Technology
📦 64-TQFP (10x10 mm)
dsPIC33EV 16-bit DSC core · 60 MIPS · 60 MHz · 128 KB (43K x 24) Flash with ECC · 8 KB · 5 V (5V-robust family) · 1 x CAN with 32 buffers, 16 filters, 3 masks · 2 x SENT J2716 transmit/receive

Magkontak para sa presyo

Tingnan ang Datasheet →

DSPIC33EV128GM106-H/PT

✅ Drop-In
📦 64-TQFP (10x10 mm)
same die, 40 MHz core basis with reduced peripheral set (7 timers, 4 DMA retained); lower operating envelope for cost-sensitive builds

📋 Alternatibo na Reference (hindi sa katalogo)

DSPIC33EV128GM106T-I/PT

✅ Drop-In
Microchip Technology
📦 64-TQFP (10x10 mm)
16-bit dsPIC33E DSC core · 70 MIPS · 40 MHz · 128KB (43K x 24) ECC Flash · 8KB (8K x 8) · 4.5 V to 5.5 V · 10/12-bit · 36 channels

Magkontak para sa presyo

Tingnan ang Datasheet →

DSPIC33EV128GM106-I/PT Mga Pinakamataas na Rating at Electrical Characteristics

Core Architecture dsPIC33E (16-bit DSC, Harvard)
Maximum CPU Speed 70 MIPS
Program Flash 128 KB (43K x 24), with ECC
RAM 8 KB
Operating Voltage 4.5 V to 5.5 V
Temperature na Operasyon -40 C to +125 C (industrial, -I suffix)
Packhaging 64-pin TQFP (10x10 mm, 0.5 mm pitch)
ADC 12-bit, up to 16 channels
DMA Channels 4
Timers 7
CAN 1 (hardware CAN module)
Comparators Yes, with 5 ns response
Op-Amps Yes, on-chip
PWM Channels Yes, motor-control PWM peripherals
Peripheral Pin Select (PPS) Yes
Functional Safety FuSa-ready, ECC Flash, Class B safety library
ICSP Programming PGECx/PGEDx pairs
RoHS Compliant

Gabay sa Pin Configuration ng DSPIC33EV128GM106-I/PT 64-pin tqfp (10x10 mm, 0.5 mm pitch)

Pin configuration para sa DSPIC33EV128GM106-I/PT (64-pin tqfp (10x10 mm, 0.5 mm pitch) package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.

Pinout diagram ng 64-pin tqfp (10x10 mm, 0.5 mm pitch) package para sa DSPIC33EV128GM106-I/PT

Wala ng detalyadong pinout data na magagamit para sa DSPIC33EV128GM106-I/PT.

Sumangguni sa datasheet para sa buong pin configuration.

Tipikal na mga Gamit

DSPIC33EV128GM106-I/PT ay nararapat para sa 3 aplikasyons: Mga Embedded System, Mga IoT Device, Industrial na Kontrol.

🧩

Mga Embedded System

Pangunahing pagproseso sa mga embedded application gamit ang DSPIC33EV128GM106-I/PT.

🌐

Mga IoT Device

Mga smart connected device na pinapagana ng DSPIC33EV128GM106-I/PT.

🏭

Industrial na Kontrol

Mga automation at control system gamit ang DSPIC33EV128GM106-I/PT.

Wala ng FAQ na magagamit para sa produkto na ito.

Impormasyon ng Talumpati sa Engineering for DSPIC33EV128GM106-I/PT — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.

Ikabit sa Mga Alternatibo

Parametro Ito ang Producto DSPIC33EV128GM106-E/PT DSPIC33EV128GM106-H/PT DSPIC33EV128GM106T-I/PT
Package 64-TQFP (10x10 mm, 0.5 mm pitch) 64-TQFP (10x10 mm) - same 64-TQFP (10x10 mm) - same 64-TQFP (10x10 mm) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Flash Memory 128 KB ECC (43K x 24) 128 KB ECC 128 KB ECC 128 KB ECC
SRAM 8 KB 8 KB 8 KB 8 KB
Core Performance 16-bit, up to 70 MIPS 16-bit, up to 70 MIPS 16-bit, 40 MHz core basis 16-bit, up to 70 MIPS
Temperature Grade Industrial (-40C to +85C, I suffix) Extended (to +125C, E suffix) Industrial -40C range Industrial (I suffix)
DMA Channels / Timers 4 / 7 4 / 7 4 / 7 4 / 7
Packaging Format Tray Tray Tray Tape & Reel

Pangunahing mga Pagkakaiba

  • 5V-native operation (kumpara saSTM32F3 series)
  • Extended-temperature same-die upgrade path (kumpara saDSPIC33EV128GM106-E/PT)
  • ECC Flash for noise immunity (kumpara saPIC17C756A-33I/PT (legacy))

Talaan ng Disenyo

Connect ALL VDD and VSS pins of the 64-TQFP package to the 5V rail and ground planes - Microchip programming documentation explicitly requires all supply pins connected for reliable ICSP and operation. Place a 100 nF ceramic decoupling capacitor at each VDD/VSS pair, close to the pins, plus bulk capacitance near the regulator. The 10x10 mm TQFP with 0.5 mm pitch requires standard 0.5 mm pitch land patterns per IPC-7351 conventions; verify solder-mask openings for the fine-pitch corners.

When wiring the ICSP header, use clock and data pins from the SAME PGECx/PGEDx pair - the dsPIC33EV128GM106 has multiple pairs and mixing (e.g., PGEC2 for ICSPCLK with PGED1 for ICSPDAT) prevents programming. Per Northern Software device notes, any pair may be used but must be kept matched. Also verify the supply stays within 4.5V-5.5V under all load transients; brownouts below the minimum can corrupt Flash writes during field firmware updates.

The 5V-native core is an advantage but also a thermal consideration: at 70 MIPS with all peripherals active, current consumption is highest of the family operating points (exact Idd figures: consult the family datasheet DS70005144H electrical characteristics tables). Estimated: at a typical 60-80 mA active current from a 5V rail, the DSC dissipates roughly 0.3-0.4 W, which the 64-TQFP theta_JA can handle on a standard 2-layer board without heatsinking; confirm against the datasheet table for your clock configuration.

The 5V I/O domain gives roughly 50% more noise margin than 3.3V logic, which is the family's key value in motor-drive and automotive cabinets - exploit it by routing long sensor lines at 5V levels rather than adding shielded cables for 3.3V signals. For CAN nodes, keep the transceiver (e.g., MCP2551) close to the CAN pins and stub the bus symmetrically. The hardware barrel shifter and MAC instructions run deterministically, so keep ISR paths free of division-heavy code to preserve real-time jitter budgets.

Impormasyon ng Pagsunod sa Kautusan

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Walang Lead
Unknown
Walang Halogen
Unknown
Mga Conflict Mineral
Unknown

Compliance status of the exact ordering code is not stated in the reviewed data; verify on the Microchip product page environmental datasheet. The family is positioned by Microchip for automotive applications, and DigiKey lists Functional Safety (FuSa) supported variants within the dsPIC33EV family.

Data napatotohanan sa: 2026-09-26 — impormasyon na pinatunayan at pinapatakbo ng pangkat ng engineering ng XAIPART's component engineering team

Kaugnay na Hanapin

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Mga kaugnay na Mga Komponente at mga Tuntunin

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