EP1AGX60CF484C8N - Arria GX FPGA 60K LE BGA-484 | Altera
MPN: EP1AGX60CF484C8N ✗ Tapus ng BuhayEP1AGX60CF484C8N Ulas
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that lets engineers implement arbitrary digital logic in silicon via a bitstream configuration. Within the broader semiconductor taxonomy, FPGAs sit beside ASICs and CPLDs as reconfigurable logic, and Arria GX specifically targets cost-sensitive mid-range applications with embedded transceivers, bridging the gap between low-cost Cyclone and high-end Stratix families.
Key features include 2,528,640 bits of embedded RAM (252 M9K blocks of 9 Kbit each), 252 embedded 18x18 multipliers for DSP functions, four PLLs for clock management, and 229 user I/O pins. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, plus dedicated DDR/DDR2/QDR memory interfaces up to 200 MHz. Configuration is supported via active serial, passive serial, or JTAG.
Architecturally the EP1AGX60 uses a 90 nm process node with a Lookup-Table (LUT) based logic fabric and dedicated transceiver circuitry. Each transceiver supports data rates from 600 Mbps up to 3.125 Gbps, suitable for the Gigabit Ethernet and PCI Express Gen1 protocol set of the era. Embedded multiplier blocks accelerate DSP workloads such as FIR filters and FFT butterflies without consuming general logic.
Typical applications include telecommunications line cards, broadcast video processing, industrial imaging, test and measurement equipment, and PCI Express endpoint cards. Designers also use Arria GX for protocol bridging between RapidIO and Ethernet, as well as DSP co-processing for wireless base stations and medical imaging.
When designing with this device, plan board layout carefully - 484-ball FCBGA packages require high-density BGA fanout, controlled-impedance routing for transceiver channels, and multi-layer PCB stack-ups with continuous reference planes. The Quartus II design software is required for synthesis, place-and-route, and bitstream generation. Designers must also implement JTAG-based programming headers for in-system configuration.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Mga alternatibo na pwedeng ilagay na EP1AGX60CF484C8N — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok EP1AGX60CF484C8N (parehas na form factor at footprint) — pagkakaiba sa Speed Grade, Package, Transceiver Data Rate, Family, Logic Elements.
EP1AGX60CF484C7N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1AGX60CF484C6N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1AGX60CF484I6N
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP1AGX60CF484I7N
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP1AGX60EF484C8N
✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo📋 Alternatibo na Reference (hindi sa katalogo)
EP1AGX60CF484C8N Mga Pinakamataas na Rating at Electrical Characteristics
| Family | Arria GX |
| Logic Elements | 60,000 |
| Embedded RAM | 2,528,640 bits (252 M9K blocks) |
| Embedded Multipliers | 252 (18x18) |
| User I/O | 229 |
| Transceivers | Up to 24 channels |
| Transceiver Data Rate | 600 Mbps to 3.125 Gbps |
| PLLs | 4 |
| Global Clocks | 16 |
| Packhaging | 484-ball FCBGA (FineLine BGA) |
| Speed Grade | C8 (commercial, -8) |
| Temperature na Operasyon | 0C to +85C (commercial) |
| Process Node | 90 nm |
| Uri ng Pagpapasok | Surface Mount |
| Level ng MSL | 3 (168 hours) |
Gabay sa Pin Configuration ng EP1AGX60CF484C8N 484-ball fcbga (fineline bga)
Pin configuration para sa EP1AGX60CF484C8N (484-ball fcbga (fineline bga) package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa EP1AGX60CF484C8N.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
EP1AGX60CF484C8N ay nararapat para sa 6 aplikasyons: Telecommunications Line Cards, Broadcast Video Processing, PCI Express Endpoint Cards, Test and Measurement Equipment, Industrial Imaging Systems, Wireless Base Station DSP Co-Processing.
Telecommunications Line Cards
The EP1AGX60CF484C8N suits mid-range telecom line cards where up to 24 multi-gigabit transceivers handle backplane serial links. Each transceiver supports 600 Mbps to 3.125 Gbps data rates, sufficient for OC-48/STM-16, Gigabit Ethernet, and RapidIO interconnects commonly used in 2007-2012 era telecom infrastructure. With 60K logic elements and 252 18x18 multipliers, the device can implement packet classification, traffic shaping, and framer/HDLC functions alongside the physical-layer hard IP. Designers use the dedicated PLLs for jitter-clean clock synthesis and DDR2/QDR memory controllers for high-bandwidth lookup table access.
Inirekomenda
Broadcast Video Processing
The 60K logic-element capacity and 252 DSP multipliers make the EP1AGX60CF484C8N well-suited for broadcast video processing, including SD/HD/3G-SDI routing, color space conversion, and real-time video scaling. The Arria GX architecture provides parallel DSP blocks that can implement 2D FIR filters and motion-adaptive deinterlacing at 1080p60 throughput. External DDR2 memory interfaces support frame buffer storage with up to 200 MHz clock rates. The 484-ball BGA package exposes 229 user I/O for parallel video bus connections and GPIO.
Inirekomenda
PCI Express Endpoint Cards
The EP1AGX60CF484C8N includes hard PCI Express IP in its transceiver channels, enabling x1 and x4 endpoint implementations at the 2.5 Gbps Gen1 rate without external PHY chips. The 60K logic elements provide ample headroom for endpoint DMA engines, MSI/MSI-X interrupt controllers, and application-layer protocol stacks such as bus-master DMA for data acquisition cards. Designers use the embedded transceivers for the PCIe lanes and remaining user I/O for parallel expansion connectors.
Inirekomenda
Test and Measurement Equipment
Test and measurement instruments benefit from the EP1AGX60CF484C8N combination of high logic density, multi-gigabit transceivers, and abundant DSP blocks. Logic analyzers, protocol exercisers, and signal generators use the 60K LEs for state machine control and pattern generation, while 252 18x18 multipliers implement real-time FIR filtering and FFT-based spectrum analysis. Transceivers drive up to 3.125 Gbps serial test interfaces such as XAUI and Serial RapidIO for inter-instrument communication.
Inirekomenda
Industrial Imaging Systems
The EP1AGX60CF484C8N supports industrial imaging pipelines including Camera Link, LVDS-based sensor aggregation, and real-time image preprocessing. The 229 user I/O pairs include LVDS receivers suitable for direct Camera Link Base/Medium/Full configuration interfaces. With 252 18x18 multipliers, the FPGA performs real-time Bayer demosaicing, color matrix conversion, and edge enhancement at line rates exceeding 100 MPixels/sec. Industrial temperature grades (I6/I7) are available for factory-floor deployments.
Inirekomenda
Wireless Base Station DSP Co-Processing
In wireless base station designs the EP1AGX60CF484C8N serves as a DSP co-processor alongside baseband ASICs. The 252 18x18 multipliers implement channelization, pulse shaping, and crest factor reduction for LTE and WiMAX signal chains. Multi-gigabit transceivers connect to CPRI or OBSAI fronthaul links between the baseband unit and remote radio head. The 60K logic-element capacity is sufficient for multi-antenna MIMO processing and digital pre-distortion loops at typical 20 MHz LTE channel bandwidths.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EP1AGX60CF484C8N — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EP1AGX60CF484C7N | EP1AGX60CF484C6N | EP1AGX60CF484I6N | EP1AGX60CF484I7N | EP1AGX60EF484C8N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-ball FCBGA | 484-ball FCBGA - same | 484-ball FCBGA - same | 484-ball FCBGA - same | 484-ball FCBGA - same | 484-ball FCBGA - same |
| Logic Elements | 60,000 | 60,000 | 60,000 | 60,000 | 60,000 | 60,000 |
| Speed Grade | C8 | C7 (faster) | C6 (fastest) | I6 (industrial, fast) | I7 (industrial, mid) | C8 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Embedded RAM | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits |
| Embedded Multipliers | 252 (18x18) | 252 | 252 | 252 | 252 | 252 |
| Transceivers | Up to 24 ch, 3.125 Gbps | Up to 24 ch, 3.125 Gbps | Up to 24 ch, 3.125 Gbps | Up to 24 ch, 3.125 Gbps | Up to 24 ch, 3.125 Gbps | Up to 24 ch, 3.125 Gbps |
Pangunahing mga Pagkakaiba
- Slower speed grade allows lower-cost system timing margins (kumpara saEP1AGX60CF484C6N)
- Commercial temperature range allows operation in 0C to +85C (kumpara saEP1AGX60CF484I6N)
- Direct 484-ball BGA compatibility with other Arria GX family members (kumpara saEP1AGX60EF484C8N)
Talaan ng Disenyo
The 484-ball FCBGA package requires a multi-layer PCB with microvia or via-in-pad construction for reliable BGA assembly. Use at least an 8-layer stack-up with continuous ground and power planes directly beneath the device. All transceiver channels require controlled-impedance differential routing (typically 100 ohm differential) with length matching to within 5 mil across a pair and within 100 mil across lanes to avoid skew-induced eye closure.
Estimated: At maximum toggle rate and 100% resource utilization, the Arria GX EP1AGX60 can dissipate 5-8W. The 484-ball FCBGA package has theta_JA of approximately 15 C/W with a JEDEC JESD51 test board (depending on airflow), so junction temperature rise could reach 75-120C above ambient at full power. Mount a heatsink or thermal interface material if power dissipation exceeds 4W, particularly in sealed industrial enclosures.
Do not confuse the Altera/Intel speed-grade ordering convention - lower numbers are FASTER (C6 faster than C7 faster than C8). Confirm Fmax requirements against the chosen speed grade before PCB layout. Also note that the device is NRND (Not Recommended for New Designs); consider migrating to Cyclone 10 GX (10CX220YF484I5G) for new projects with active lifecycle support and modern Quartus Prime tool compatibility.
Impormasyon ng Pagsunod sa Kautusan
RoHS and lead-free per Altera product page. Not AEC-Q100 qualified (FPGAs typically are not automotive-qualified unless explicitly listed in industrial automotive grade variants).
