EP1AGX60CF484C8N - Arria GX FPGA 60K LE BGA-484 | Altera
MPN： EP1AGX60CF484C8N ✗ 停產EP1AGX60CF484C8N 概覽
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that lets engineers implement arbitrary digital logic in silicon via a bitstream configuration. Within the broader semiconductor taxonomy, FPGAs sit beside ASICs and CPLDs as reconfigurable logic, and Arria GX specifically targets cost-sensitive mid-range applications with embedded transceivers, bridging the gap between low-cost Cyclone and high-end Stratix families.
Key features include 2,528,640 bits of embedded RAM (252 M9K blocks of 9 Kbit each), 252 embedded 18x18 multipliers for DSP functions, four PLLs for clock management, and 229 user I/O pins. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, plus dedicated DDR/DDR2/QDR memory interfaces up to 200 MHz. Configuration is supported via active serial, passive serial, or JTAG.
Architecturally the EP1AGX60 uses a 90 nm process node with a Lookup-Table (LUT) based logic fabric and dedicated transceiver circuitry. Each transceiver supports data rates from 600 Mbps up to 3.125 Gbps, suitable for the Gigabit Ethernet and PCI Express Gen1 protocol set of the era. Embedded multiplier blocks accelerate DSP workloads such as FIR filters and FFT butterflies without consuming general logic.
Typical applications include telecommunications line cards, broadcast video processing, industrial imaging, test and measurement equipment, and PCI Express endpoint cards. Designers also use Arria GX for protocol bridging between RapidIO and Ethernet, as well as DSP co-processing for wireless base stations and medical imaging.
When designing with this device, plan board layout carefully - 484-ball FCBGA packages require high-density BGA fanout, controlled-impedance routing for transceiver channels, and multi-layer PCB stack-ups with continuous reference planes. The Quartus II design software is required for synthesis, place-and-route, and bitstream generation. Designers must also implement JTAG-based programming headers for in-system configuration.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 EP1AGX60CF484C8N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP1AGX60CF484C8N （相同外形與佔位） — 差異在於 Speed Grade, Package, Transceiver Data Rate, Family, Logic Elements.
EP1AGX60CF484C7N
✅ 直接替換聯絡詢價
查看資料表 →EP1AGX60CF484C6N
✅ 直接替換聯絡詢價
查看資料表 →EP1AGX60CF484I6N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1AGX60CF484I7N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP1AGX60EF484C8N
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
EP1AGX60CF484C8N 最大額定值與電氣特性
| Family | Arria GX |
| Logic Elements | 60,000 |
| Embedded RAM | 2,528,640 bits (252 M9K blocks) |
| Embedded Multipliers | 252 (18x18) |
| User I/O | 229 |
| Transceivers | Up to 24 channels |
| Transceiver Data Rate | 600 Mbps to 3.125 Gbps |
| PLLs | 4 |
| Global Clocks | 16 |
| 封裝 | 484-ball FCBGA (FineLine BGA) |
| Speed Grade | C8 (commercial, -8) |
| 工作溫度 | 0C to +85C (commercial) |
| Process Node | 90 nm |
| 安裝類型 | Surface Mount |
| MSL 等級 | 3 (168 hours) |
EP1AGX60CF484C8N 484-ball fcbga (fineline bga) 腳位配置指南
EP1AGX60CF484C8N（484-ball fcbga (fineline bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP1AGX60CF484C8N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP1AGX60CF484C8N 適用於 6 應用s: Telecommunications Line Cards, Broadcast Video Processing, PCI Express Endpoint Cards, Test and Measurement Equipment, Industrial Imaging Systems, Wireless Base Station DSP Co-Processing.
Telecommunications Line Cards
The EP1AGX60CF484C8N suits mid-range telecom line cards where up to 24 multi-gigabit transceivers handle backplane serial links. Each transceiver supports 600 Mbps to 3.125 Gbps data rates, sufficient for OC-48/STM-16, Gigabit Ethernet, and RapidIO interconnects commonly used in 2007-2012 era telecom infrastructure. With 60K logic elements and 252 18x18 multipliers, the device can implement packet classification, traffic shaping, and framer/HDLC functions alongside the physical-layer hard IP. Designers use the dedicated PLLs for jitter-clean clock synthesis and DDR2/QDR memory controllers for high-bandwidth lookup table access.
推薦
Broadcast Video Processing
The 60K logic-element capacity and 252 DSP multipliers make the EP1AGX60CF484C8N well-suited for broadcast video processing, including SD/HD/3G-SDI routing, color space conversion, and real-time video scaling. The Arria GX architecture provides parallel DSP blocks that can implement 2D FIR filters and motion-adaptive deinterlacing at 1080p60 throughput. External DDR2 memory interfaces support frame buffer storage with up to 200 MHz clock rates. The 484-ball BGA package exposes 229 user I/O for parallel video bus connections and GPIO.
推薦
PCI Express Endpoint Cards
The EP1AGX60CF484C8N includes hard PCI Express IP in its transceiver channels, enabling x1 and x4 endpoint implementations at the 2.5 Gbps Gen1 rate without external PHY chips. The 60K logic elements provide ample headroom for endpoint DMA engines, MSI/MSI-X interrupt controllers, and application-layer protocol stacks such as bus-master DMA for data acquisition cards. Designers use the embedded transceivers for the PCIe lanes and remaining user I/O for parallel expansion connectors.
推薦
Test and Measurement Equipment
Test and measurement instruments benefit from the EP1AGX60CF484C8N combination of high logic density, multi-gigabit transceivers, and abundant DSP blocks. Logic analyzers, protocol exercisers, and signal generators use the 60K LEs for state machine control and pattern generation, while 252 18x18 multipliers implement real-time FIR filtering and FFT-based spectrum analysis. Transceivers drive up to 3.125 Gbps serial test interfaces such as XAUI and Serial RapidIO for inter-instrument communication.
推薦
Industrial Imaging Systems
The EP1AGX60CF484C8N supports industrial imaging pipelines including Camera Link, LVDS-based sensor aggregation, and real-time image preprocessing. The 229 user I/O pairs include LVDS receivers suitable for direct Camera Link Base/Medium/Full configuration interfaces. With 252 18x18 multipliers, the FPGA performs real-time Bayer demosaicing, color matrix conversion, and edge enhancement at line rates exceeding 100 MPixels/sec. Industrial temperature grades (I6/I7) are available for factory-floor deployments.
推薦
Wireless Base Station DSP Co-Processing
In wireless base station designs the EP1AGX60CF484C8N serves as a DSP co-processor alongside baseband ASICs. The 252 18x18 multipliers implement channelization, pulse shaping, and crest factor reduction for LTE and WiMAX signal chains. Multi-gigabit transceivers connect to CPRI or OBSAI fronthaul links between the baseband unit and remote radio head. The 60K logic-element capacity is sufficient for multi-antenna MIMO processing and digital pre-distortion loops at typical 20 MHz LTE channel bandwidths.
推薦
推薦產品摘要
工程參考資料，適用於 EP1AGX60CF484C8N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP1AGX60CF484C7N | EP1AGX60CF484C6N | EP1AGX60CF484I6N | EP1AGX60CF484I7N | EP1AGX60EF484C8N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-ball FCBGA | 484-ball FCBGA - same | 484-ball FCBGA - same | 484-ball FCBGA - same | 484-ball FCBGA - same | 484-ball FCBGA - same |
| Logic Elements | 60,000 | 60,000 | 60,000 | 60,000 | 60,000 | 60,000 |
| Speed Grade | C8 | C7 (faster) | C6 (fastest) | I6 (industrial, fast) | I7 (industrial, mid) | C8 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Embedded RAM | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits |
| Embedded Multipliers | 252 (18x18) | 252 | 252 | 252 | 252 | 252 |
| Transceivers | Up to 24 ch, 3.125 Gbps | Up to 24 ch, 3.125 Gbps | Up to 24 ch, 3.125 Gbps | Up to 24 ch, 3.125 Gbps | Up to 24 ch, 3.125 Gbps | Up to 24 ch, 3.125 Gbps |
主要差異化特點
- Slower speed grade allows lower-cost system timing margins (對比EP1AGX60CF484C6N)
- Commercial temperature range allows operation in 0C to +85C (對比EP1AGX60CF484I6N)
- Direct 484-ball BGA compatibility with other Arria GX family members (對比EP1AGX60EF484C8N)
設計說明
The 484-ball FCBGA package requires a multi-layer PCB with microvia or via-in-pad construction for reliable BGA assembly. Use at least an 8-layer stack-up with continuous ground and power planes directly beneath the device. All transceiver channels require controlled-impedance differential routing (typically 100 ohm differential) with length matching to within 5 mil across a pair and within 100 mil across lanes to avoid skew-induced eye closure.
Estimated: At maximum toggle rate and 100% resource utilization, the Arria GX EP1AGX60 can dissipate 5-8W. The 484-ball FCBGA package has theta_JA of approximately 15 C/W with a JEDEC JESD51 test board (depending on airflow), so junction temperature rise could reach 75-120C above ambient at full power. Mount a heatsink or thermal interface material if power dissipation exceeds 4W, particularly in sealed industrial enclosures.
Do not confuse the Altera/Intel speed-grade ordering convention - lower numbers are FASTER (C6 faster than C7 faster than C8). Confirm Fmax requirements against the chosen speed grade before PCB layout. Also note that the device is NRND (Not Recommended for New Designs); consider migrating to Cyclone 10 GX (10CX220YF484I5G) for new projects with active lifecycle support and modern Quartus Prime tool compatibility.
合規資訊
RoHS and lead-free per Altera product page. Not AEC-Q100 qualified (FPGAs typically are not automotive-qualified unless explicitly listed in industrial automotive grade variants).
