EP1S30F1020C6N - 32,470 Logic Elements Stratix FPGA, 1020-BGA | Intel
MPN: EP1S30F1020C6N ✗ Tapus ng BuhayEP1S30F1020C6N Ulas
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected through programmable interconnect, allowing designers to implement custom digital logic functions after manufacturing. The Stratix family sits within the programmable logic device (PLD) hierarchy: FPGA -> programmable logic device -> logic IC -> integrated circuit. Compared with ASICs, FPGAs offer rapid time-to-market, in-field re-programmability, and the ability to update functionality over the product lifecycle without respinning silicon.
Key features of the EP1S30F1020C6N include dedicated embedded multiplier blocks, embedded TriMatrix memory blocks for distributed and block RAM, four enhanced phase-locked loops (PLLs), and high-speed LVDS and DDR memory interfaces. The 1020-ball FC-FBGA package with 1.0 mm ball pitch allows the 30,740 typical gates to be placed in a single chip, with 726 user I/O enabling high-bandwidth parallel connectivity. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, PCI-X, LVDS, LVPECL, and HSTL for protocol-flexible board design.
The Stratix architecture combines a fine-grained logic fabric with hardened memory and DSP blocks, allowing high-throughput pipelines without consuming general-purpose logic. The on-chip TriMatrix memory subsystem supports true dual-port RAM, FIFO buffers, and shift registers at hundreds of MHz. Four enhanced PLLs provide clock multiplication, division, phase shifting, and zero-delay buffering for high-speed synchronous designs.
Typical applications include ASIC prototyping and emulation, high-speed telecom line cards, software defined radio, military radar signal processing, and high-end image processing. The combination of high logic density, embedded memory, and dedicated multipliers makes the EP1S30F1020C6N well-suited to designs that require both control logic and parallel DSP arithmetic on a single device.
When designing with this part, pay close attention to the 1020-BGA layout: 1.0 mm pitch balls require multi-layer PCB with laser-drilled or micro-via stackups. Thermal management must consider the 33x33 mm body, and the configuration scheme (EPC16 or EPC4 configuration device) must be selected to match the design density. This page synthesizes distributor stock, current pricing, and practical FPGA migration guidance not found in the manufacturer datasheet alone.
Mga alternatibo na pwedeng ilagay na EP1S30F1020C6N — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok EP1S30F1020C6N (parehas na form factor at footprint) — pagkakaiba sa Operating Temperature, Speed Grade, Package Type, Family, Logic Elements.
EP1S30F1020C7N
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP1S30F1020I6N
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP1S30F1020I7N
✅ Drop-In ⚠️ Mga Talaan Hindi Naiwerikmo📋 Alternatibo na Reference (hindi sa katalogo)
EP1S40F1020C6N
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP1S30F1020C5N
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP1S30F1020C6N Mga Pinakamataas na Rating at Electrical Characteristics
| Series | Stratix |
| Family | Stratix FPGA |
| Logic Elements | 32,470 |
| Total RAM Bits | 3,317,184 |
| Typical Gates | 30,740 (per manufacturer) |
| User I/O Count | 726 |
| Number of Logic Cells | 32,470 |
| Operating Frequency (max) | 450 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Package Type | 1020-BBGA (FC-FBGA, 33x33 mm, 1.0 mm pitch) |
| Uri ng Pagpapasok | Surface Mount |
| Temperature na Operasyon | 0 C to +85 C (Commercial) |
| Speed Grade | 6 |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, PCI-X, LVDS, LVPECL, HSTL |
Gabay sa Pin Configuration ng EP1S30F1020C6N 1020-bbga (fc-fbga, 33x33 mm, 1.0 mm pitch)
Pin configuration para sa EP1S30F1020C6N (1020-bbga (fc-fbga, 33x33 mm, 1.0 mm pitch) package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa EP1S30F1020C6N.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
EP1S30F1020C6N ay nararapat para sa 6 aplikasyons: ASIC Prototyping and Emulation, Telecom Line Card Signal Processing, Software Defined Radio (SDR) Baseband, Military Radar Signal Processing, High-End Image and Video Processing, Industrial Test and Measurement Equipment.
ASIC Prototyping and Emulation
The EP1S30F1020C6N fits ASIC prototyping and emulation because of its 32,470 logic elements and 3,317,184 RAM bits, which can map a wide range of mid-complexity ASIC RTL before tape-out. The 726 user I/O give the part enough package pins to expose ASIC boundary signals, while embedded TriMatrix blocks emulate ASIC SRAM without consuming logic fabric. Designers run verification at 200-300 MHz, then migrate to the ASIC, with Quartus II and Synplify supporting the same RTL. Pin-to-pin compatibility with EP1S30F1020C7N and EP1S30F1020I6N lets the same board serve both commercial and industrial prototype builds.
Inirekomenda
Telecom Line Card Signal Processing
The EP1S30F1020C6N serves telecom line cards where high logic density, 726 I/O, and embedded DSP blocks are needed for channel aggregation and forward error correction. The 1.5 V core plus on-chip PLLs clock the fabric at up to 450 MHz, fast enough for OC-48/STM-16 class data paths. LVDS and HSTL I/O standards connect directly to serializer/deserializer (SerDes) devices and DDR memory. The 1020-BGA delivers sufficient I/O for parallel multi-port interfaces.
Inirekomenda
Software Defined Radio (SDR) Baseband
The EP1S30F1020C6N is a strong fit for SDR baseband because its embedded multiplier blocks and 3,317,184 RAM bits deliver the throughput needed for digital up/down conversion and demodulation. Fabricated on 130 nm CMOS, the part achieves Fmax around 200-300 MHz on DSP-heavy paths. The 726 I/O bring in high-speed LVDS data from ADC front-ends, and 1.5 V core simplifies power tree design. Industrial-grade EP1S30F1020I6N is preferred for outdoor base-station deployments.
Inirekomenda
Military Radar Signal Processing
The EP1S30F1020C6N is well-suited to military radar pulse compression and beamforming because of its 3,317,184 RAM bits (for FFT window buffers) and 32,470 logic elements (for control and arithmetic). The Stratix fabric is widely used in legacy defense designs and the 1020-BGA supports dense parallel ADC interfaces. Designs targeting harsh environments should use the EP1S30F1020I6N industrial variant. The 130 nm process is qualified for legacy military programs and the part is broadly available through defense distributors.
Inirekomenda
High-End Image and Video Processing
The EP1S30F1020C6N fits high-end image processing pipelines that need parallel line buffers and high I/O. The 3,317,184 RAM bits hold several full image lines in on-chip memory, eliminating the need for external SRAM for many pipelines. The 726 I/O ingest multi-channel LVDS camera links, and the four enhanced PLLs generate the multiple clocks a video pipeline requires. Pin compatibility with EP1S30F1020C7N gives headroom for speed closure on the bottleneck stage.
Inirekomenda
Industrial Test and Measurement Equipment
The EP1S30F1020C6N works in industrial test and measurement because its 726 I/O, fast PLLs, and high logic count suit protocol-aware test heads. The 450 MHz internal clock drives 200+ MHz state machines, and LVDS pairs interface to high-speed ADCs. The commercial temperature range covers indoor lab and factory environments. Migration to EP1S30F1020I6N is straightforward for outdoor or field-deployed testers via identical 1020-BGA footprint.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EP1S30F1020C6N — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EP1S30F1020C7N | EP1S30F1020I6N | EP1S30F1020I7N | EP1S40F1020C6N | EP1S30F1020C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-BBGA (FC-FBGA, 33x33 mm, 1.0 mm pitch) | 1020-BBGA (FC-FBGA, 33x33 mm) - same | 1020-BBGA (FC-FBGA, 33x33 mm) - same | 1020-BBGA (FC-FBGA, 33x33 mm) - same | 1020-BBGA (FC-FBGA, 33x33 mm) - same | 1020-BBGA (FC-FBGA, 33x33 mm) - same |
| Logic Elements | 32,470 | 32,470 | 32,470 | 32,470 | 41,250 | 32,470 |
| Total RAM Bits | 3,317,184 | 3,317,184 | 3,317,184 | 3,317,184 | 4,478,720 | 3,317,184 |
| User I/O | 726 | 726 | 726 | 726 | 726 | 726 |
| Speed Grade | 6 | 7 | 6 | 7 | 6 | 5 |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Pangunahing mga Pagkakaiba
- Maximum logic density in the EP1S series in 1020-BGA (kumpara saEP1S25F1020C6N)
- Higher I/O count than 780-BGA siblings (kumpara saEP1S30F780C7)
- Commercial temperature 0-85C at speed grade 6 (kumpara saEP1S30F1020I7N)
Talaan ng Disenyo
The 1020-BGA uses 1.0 mm ball pitch, which demands a multi-layer PCB stackup with micro-via or laser-drilled vias. A 4- or 6-layer build is feasible with HDI (high-density interconnect) processes. Use a 0.5-0.8 mm diameter land pad and NSMD (non-solder-mask-defined) pads for reliable reflow. Escape routing on the top layer should fan out to a 0.5 mm via pitch, then inner-layer breakouts to keep impedance controlled. The 33x33 mm body requires a panel-level thermal relief copper pour to spread the heat from 32,470 toggling logic elements.
The EP1S30F1020C6N is obsolete and not recommended for new designs without long-term availability risk assessment. Supply is limited to remaining distributor stock, and prices fluctuate significantly. Engineers should also note that Quartus II software is required for design entry (latest version supporting EP1S series is Quartus II v13.0sp1). For new designs, consider Stratix II (EP2S series) or later generations, which have lower power, higher logic density, and active support. Pin-compatible migration to EP1S30F1020C7N or EP1S30F1020I6N works on the same 1020-BGA footprint but is still an obsolete silicon.
Estimated: At typical 50% toggle rate and 1.5 V core at 200 MHz, the EP1S30F1020C6N draws approximately 4-6 W of core power. The 33x33 mm BGA has theta_JA in the 8-12 C/W range with adequate bottom-side thermal balls exposed to PCB copper. Design the PCB with at least 1 oz copper on the inner layers directly under the BGA and 2 oz on the top layer to spread heat. No external heatsink is normally required; however, sealed enclosures should include a heat-spreader plate contacting the top of the BGA via a thermal interface material.
Impormasyon ng Pagsunod sa Kautusan
The EP1S30F1020C6N is an obsolete Intel/Altera Stratix FPGA. The 'N' suffix typically indicates lead-free terminal finish per Altera's historical nomenclature, but RoHS/REACH compliance was not explicitly confirmed in the verified data. AEC-Q100 is not applicable since this is a commercial-grade FPGA, not an automotive-qualified part.
