EP1S30F1020C7N - Stratix 32k LE FPGA, 1020-BGA, 420MHz | Intel
MPN: EP1S30F1020C7N ✗ Tapus ng BuhayEP1S30F1020C7N Ulas
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit within the broader semiconductor hierarchy as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field to implement arbitrary digital logic, glue functions, signal-processing pipelines, and full system-on-chip prototypes.
Key features include 3,244 Kbits (M4K) + 144 Kbits (M-RAM) of block RAM, dedicated DSP blocks for high-throughput arithmetic, up to 16 global clock networks with PLL support, and Stratix-tier I/O support including LVDS, SSTL, and HSTL standards. The 1020-pin FineLine BGA exposes 726 user I/Os, leaving the remaining balls for power, ground, configuration, and JTAG.
The Stratix architecture combines a TriMatrix memory structure (MLAB + M4K + M-RAM) with DSP blocks optimized for finite-impulse-response (FIR) filters and complex FFT pipelines. The 130 nm process delivers an internal clock performance envelope of 420 MHz, making the part suitable for parallel DSP workloads, telecom channel cards, and prototyping of ASIC-class signal chains before tape-out.
Typical applications include telecom baseband processing, high-speed data acquisition, software-defined radio (SDR), industrial motion control, ASIC prototyping, and military/aerospace signal processing where a high pin-count, high-density programmable fabric is required. The 1020-BGA footprint also supports multi-gigabit transceiver-rich boards when paired with companion clock devices.
When designing with this device, provide at least six PCB layers, controlled-impedance routing for all high-speed signals, and a minimum of 1 oz copper on inner power planes for the 1.5 V core rail. Thermal management relies on the exposed-die BGA lid; heatsink or airflow is required when continuous logic utilization exceeds 70%.
This page synthesizes distributor pricing, drop-in same-brand alternatives from the Stratix family, and practical design notes not aggregated in the manufacturer datasheet.
Mga alternatibo na pwedeng ilagay na EP1S30F1020C7N — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok EP1S30F1020C7N (parehas na form factor at footprint) — pagkakaiba sa Operating Temperature, Package, Family, Logic Elements, Speed Grade.
EP1S30F1020C7
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1S30F1020C6N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1S30F1020C6
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1S30F1020C5N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1S25F1020C7N
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
EP1S25F1020C7
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1S25F1020C6N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP1S30F1020C7N Mga Pinakamataas na Rating at Electrical Characteristics
| Series | Stratix |
| Family | Stratix (1.5 V core) |
| Logic Elements | 32,470 |
| Total Block RAM Bits | 3,317,184 |
| User I/O Count | 726 |
| LABs (Logic Array Blocks) | 3247 |
| Process Technology | 130 nm CMOS |
| Max Internal Frequency | 420.17 MHz |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| Package Type | 1020-ball FineLine BGA (FC-FBGA) |
| Package Dimensions | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Temperature na Operasyon | 0 C to +85 C (commercial extended) |
| Uri ng Pagpapasok | Surface Mount (BGA) |
| Level ng MSL | 3 (168 hours) |
| Peak Reflow Temperature Max Time | 40 s |
| Tindminan RoHS | Compliant |
Gabay sa Pin Configuration ng EP1S30F1020C7N 33 x 33 mm
Pin configuration para sa EP1S30F1020C7N (33 x 33 mm package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa EP1S30F1020C7N.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
EP1S30F1020C7N ay nararapat para sa 6 aplikasyons: Telecom Baseband Processing, Software Defined Radio (SDR), High-Speed Data Acquisition, ASIC Prototyping, Industrial Motion Control, Military and Aerospace Signal Processing.
Telecom Baseband Processing
The EP1S30F1020C7N's 32,470 logic elements and 3.3 Mbits of block RAM fit multi-channel telecom baseband line cards where U-plane and C-plane processing must be partitioned in parallel datapaths. Its 420 MHz internal clock and dedicated multiplier blocks enable parallel FIR filtering and Viterbi decoding at rates up to a few hundred Msymbols/s per channel. Placed on the line card between the SERDES framer and the backplane, the FPGA absorbs protocol overhead while staying within the 1.5 V core power envelope. Compared with fixed DSP ASICs, the same package can be reconfigured across product generations without board rework.
Inirekomenda
Software Defined Radio (SDR)
Software-defined radio platforms rely on FPGA fabric to perform DDC/DUC, channelization, and FFT computations in real time. The EP1S30F1020C7N's 3.3 Mbit TriMatrix RAM buffers baseband samples between the ADC front-end and the host processor, while the 32,470 logic elements and dedicated DSP blocks sustain 1024-point FFTs at sample rates beyond 100 MSPS. The 726 user I/Os accept parallel LVDS ADC data plus GPIOs for tuning and gain control. Versus discrete DSP chains, the same 1020-BGA footprint lets designers retarget the radio for new waveforms by recompiling Quartus without PCB rework.
Inirekomenda
High-Speed Data Acquisition
Multi-channel data-acquisition cards use the EP1S30F1020C7N to aggregate 8-16 LVDS ADC lanes, perform real-time decimation, and stream DMA to host memory. The device's 726 user I/Os comfortably absorb 16 LVDS pairs plus GPIO banks for trigger and clock distribution, while 3.3 Mbits of block RAM stages ping-pong buffers between ADC bursts and PCIe readout. The 420 MHz internal clock matches typical 14-bit 250 MSPS ADC data rates with margin for digital filtering. Placed adjacent to the ADC analog front-end, the FPGA keeps digital and analog grounds separate while preserving timing closure across all I/O banks.
Inirekomenda
ASIC Prototyping
ASIC prototyping platforms use the EP1S30F1020C7N as one of several Stratix FPGAs stitched together to emulate a multi-million-gate ASIC. With 32,470 logic elements per device and 3.3 Mbits of on-chip memory, the part is well-matched to a typical SoC block partition, while the 1020-BGA package exposes enough user I/Os for inter-FPGA serial or parallel channels. The -7 speed grade shortens emulation cycles by allowing higher clock rates during bring-up. Compared with larger Stratix IV/V parts, the EP1S30F1020C7N offers a familiar Quartus flow with abundant third-party IP.
Inirekomenda
Industrial Motion Control
Multi-axis servo and motor-control systems use the EP1S30F1020C7N to implement field-oriented control loops, encoder decoding, and safety logic on a single device. The 32,470 logic elements handle 8-12 axes of FOC plus resolver or SSI feedback decoding, while the dedicated PLL resources drive deterministic switching frequencies from 8 kHz to 32 kHz per axis. The 726 user I/Os accommodate quadrature encoders, PWM outputs, gate-driver enables, and EtherCAT or CAN-FD side-channels. Placed between the power stage and the host PLC, the FPGA keeps latency below one PWM period versus discrete microcontrollers.
Inirekomenda
Military and Aerospace Signal Processing
Defense and aerospace platforms use the EP1S30F1020C7N for radar, electronic-warfare, and secure-communication preprocessing where commercial microprocessors lack determinism. The part's 32,470 logic elements, 3.3 Mbit embedded RAM, and 420 MHz clock support pulse-compression, beamforming, and crypto offload on a single 1020-BGA device. The commercial/extended 0 C to +85 C temperature range covers many ground-mobile and shipboard environments, while the 1.5 V core and 1 mm-pitch BGA suit ruggedized chassis layouts. Designers should confirm long-term availability with procurement as the part is classified obsolete.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EP1S30F1020C7N — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EP1S30F1020C7 | EP1S30F1020C6N | EP1S30F1020C6 | EP1S30F1020C5N | EP1S25F1020C7N |
|---|---|---|---|---|---|---|
| Package | 1020-BGA (33x33 mm) | 1020-BGA (33x33 mm) - same | 1020-BGA (33x33 mm) - same | 1020-BGA (33x33 mm) - same | 1020-BGA (33x33 mm) - same | 1020-BGA (33x33 mm) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 32,470 | 32,470 (same) | 32,470 (same) | 32,470 (same) | 32,470 (same) | 25,660 (-21%) |
| Block RAM Bits | 3,317,184 | 3,317,184 (same) | 3,317,184 (same) | 3,317,184 (same) | 3,317,184 (same) | 1,922,048 (-42%) |
| Max Internal Frequency | 420.17 MHz | 420.17 MHz (same) | ~320 MHz (-24%) | ~320 MHz (-24%) | ~250 MHz (-40%) | 420.17 MHz (same) |
| User I/O Count | 726 | 726 (same) | 726 (same) | 726 (same) | 726 (same) | 726 (same) |
| Core Voltage | 1.5 V | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) |
| Operating Temperature | 0 C to +85 C | 0 C to +85 C (same) | 0 C to +85 C (same) | 0 C to +85 C (same) | 0 C to +85 C (same) | 0 C to +85 C (same) |
| Lead-Free Finish (N suffix) | Yes (N suffix) | No (standard finish) | Yes (N suffix) | No (standard finish) | Yes (N suffix) | Yes (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Pangunahing mga Pagkakaiba
- Highest available speed grade in the EP1S30F1020 family (kumpara saEP1S30F1020C6N)
- 32,470 logic elements versus 25,660 in the EP1S25 family (kumpara saEP1S25F1020C7N)
- Lead-free (N) finish for RoHS-compliant assemblies (kumpara saEP1S30F1020C7)
- 3.3 Mbit TriMatrix block RAM versus 1.9 Mbit on EP1S25 (kumpara saEP1S25F1020C7N)
Talaan ng Disenyo
The EP1S30F1020C7N requires four independent supply rails: VCCINT (1.5 V core), VCCIO (1.5 V/1.8 V/2.5 V/3.3 V per I/O bank), VCCA_PLL (3.3 V analog for PLL cleanliness), and VCCPD (3.3 V pre-driver). At 420 MHz with full logic utilization, estimated VCCINT current reaches 2.5 A to 3.0 A; bulk decoupling should include at least 4 x 100 uF polymer plus 24 x 0.1 uF ceramics placed under and adjacent to the BGA. Failure to keep VCCA_PLL isolated from digital switching noise will manifest as PLL jitter degradation above 50 ps RMS.
Estimated: at full 32,470-LE utilization and 420 MHz, the EP1S30F1020C7N dissipates approximately 4 to 6 W depending on switching activity. With the 33 x 33 mm FineLine BGA and a typical theta_JA of 18 C/W for a properly designed 12-layer PCB with 1 oz copper on core/inner power planes, junction temperature rises approximately 70 C to 110 C above ambient. A heatsink or 200 LFM airflow is required when continuous logic utilization exceeds 70%; verify via thermal sensor embedded in the Quartus device-health monitor.
The 1020-ball FineLine BGA requires a minimum 8-layer stackup with 1 oz copper and a 1 mm ball pitch translating to 0.5 mm escape via fan-out. Use laser-drilled stacked micro-vias for inner rows and through-vias for outer rows. Matched 50 ohm single-ended and 100 ohm differential impedance on the top layer, with the second layer as a continuous GND plane for LVDS and SSTL signal integrity. Per manufacturer reference designs, place the JTAG header within 5 cm of the FPGA to avoid TCK/TMS signal-integrity issues.
Per the manufacturer datasheet, leaving any VCCINT or VCCIO ball unconnected causes the device to malfunction regardless of overall system power. Designers must verify the complete BGA ballout against the device pin table - missed balls are a common prototype-bring-up defect. Configuration mode (AS, AP, FPP, PS) must be selected by MSEL[3..0] straps at power-up; once configured, the device will not autonomously re-enter configuration mode without a nCONFIG pulse.
Impormasyon ng Pagsunod sa Kautusan
RoHS compliant per N suffix in MPN per Intel/Altera ordering convention. AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC. Halogen-free and conflict-minerals status not verified in the provided web data and marked unknown.
