EP1S30F1020C6N - 32,470 Logic Elements Stratix FPGA, 1020-BGA | Intel
MPN: EP1S30F1020C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1333.15 | $1,333.15 |
| 10 | $1280 | $12,800.00 |
| 100 | $1190 | $119,000.00 |
| 500 | $1100 | $550,000.00 |
| 1,000 | $1015 | $1,015,000.00 |
Drop-in alternatives for EP1S30F1020C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S30F1020C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$215 / Unit
View Datasheet →EP1S30F1020I6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1750 / Unit
View Datasheet →EP1S30F1020I7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1S40F1020C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$695 / Unit
View Datasheet →EP1S30F1020C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1095 / Unit
View Datasheet →EP1S30F1020C6N Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Family | Stratix FPGA |
| Logic Elements | 32,470 |
| Total RAM Bits | 3,317,184 |
| Typical Gates | 30,740 (per manufacturer) |
| User I/O Count | 726 |
| Number of Logic Cells | 32,470 |
| Operating Frequency (max) | 450 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Package Type | 1020-BBGA (FC-FBGA, 33x33 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 C to +85 C (Commercial) |
| Speed Grade | 6 |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, PCI-X, LVDS, LVPECL, HSTL |
EP1S30F1020C6N 1020-bbga (fc-fbga, 33x33 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S30F1020C6N (1020-bbga (fc-fbga, 33x33 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S30F1020C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S30F1020C6N is suitable for 6 applications: ASIC Prototyping and Emulation, Telecom Line Card Signal Processing, Software Defined Radio (SDR) Baseband, Military Radar Signal Processing, High-End Image and Video Processing, Industrial Test and Measurement Equipment.
ASIC Prototyping and Emulation
The EP1S30F1020C6N fits ASIC prototyping and emulation because of its 32,470 logic elements and 3,317,184 RAM bits, which can map a wide range of mid-complexity ASIC RTL before tape-out. The 726 user I/O give the part enough package pins to expose ASIC boundary signals, while embedded TriMatrix blocks emulate ASIC SRAM without consuming logic fabric. Designers run verification at 200-300 MHz, then migrate to the ASIC, with Quartus II and Synplify supporting the same RTL. Pin-to-pin compatibility with EP1S30F1020C7N and EP1S30F1020I6N lets the same board serve both commercial and industrial prototype builds.
Recommended
Telecom Line Card Signal Processing
The EP1S30F1020C6N serves telecom line cards where high logic density, 726 I/O, and embedded DSP blocks are needed for channel aggregation and forward error correction. The 1.5 V core plus on-chip PLLs clock the fabric at up to 450 MHz, fast enough for OC-48/STM-16 class data paths. LVDS and HSTL I/O standards connect directly to serializer/deserializer (SerDes) devices and DDR memory. The 1020-BGA delivers sufficient I/O for parallel multi-port interfaces.
Recommended
Software Defined Radio (SDR) Baseband
The EP1S30F1020C6N is a strong fit for SDR baseband because its embedded multiplier blocks and 3,317,184 RAM bits deliver the throughput needed for digital up/down conversion and demodulation. Fabricated on 130 nm CMOS, the part achieves Fmax around 200-300 MHz on DSP-heavy paths. The 726 I/O bring in high-speed LVDS data from ADC front-ends, and 1.5 V core simplifies power tree design. Industrial-grade EP1S30F1020I6N is preferred for outdoor base-station deployments.
Recommended
Military Radar Signal Processing
The EP1S30F1020C6N is well-suited to military radar pulse compression and beamforming because of its 3,317,184 RAM bits (for FFT window buffers) and 32,470 logic elements (for control and arithmetic). The Stratix fabric is widely used in legacy defense designs and the 1020-BGA supports dense parallel ADC interfaces. Designs targeting harsh environments should use the EP1S30F1020I6N industrial variant. The 130 nm process is qualified for legacy military programs and the part is broadly available through defense distributors.
Recommended
High-End Image and Video Processing
The EP1S30F1020C6N fits high-end image processing pipelines that need parallel line buffers and high I/O. The 3,317,184 RAM bits hold several full image lines in on-chip memory, eliminating the need for external SRAM for many pipelines. The 726 I/O ingest multi-channel LVDS camera links, and the four enhanced PLLs generate the multiple clocks a video pipeline requires. Pin compatibility with EP1S30F1020C7N gives headroom for speed closure on the bottleneck stage.
Recommended
Industrial Test and Measurement Equipment
The EP1S30F1020C6N works in industrial test and measurement because its 726 I/O, fast PLLs, and high logic count suit protocol-aware test heads. The 450 MHz internal clock drives 200+ MHz state machines, and LVDS pairs interface to high-speed ADCs. The commercial temperature range covers indoor lab and factory environments. Migration to EP1S30F1020I6N is straightforward for outdoor or field-deployed testers via identical 1020-BGA footprint.
Recommended
Recommended Products Summary
Engineering reference data for EP1S30F1020C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S30F1020C7N | EP1S30F1020I6N | EP1S30F1020I7N | EP1S40F1020C6N | EP1S30F1020C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-BBGA (FC-FBGA, 33x33 mm, 1.0 mm pitch) | 1020-BBGA (FC-FBGA, 33x33 mm) - same | 1020-BBGA (FC-FBGA, 33x33 mm) - same | 1020-BBGA (FC-FBGA, 33x33 mm) - same | 1020-BBGA (FC-FBGA, 33x33 mm) - same | 1020-BBGA (FC-FBGA, 33x33 mm) - same |
| Logic Elements | 32,470 | 32,470 | 32,470 | 32,470 | 41,250 | 32,470 |
| Total RAM Bits | 3,317,184 | 3,317,184 | 3,317,184 | 3,317,184 | 4,478,720 | 3,317,184 |
| User I/O | 726 | 726 | 726 | 726 | 726 | 726 |
| Speed Grade | 6 | 7 | 6 | 7 | 6 | 5 |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Approx. Unit Price (qty 1, USD) | 1,333.15 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Maximum logic density in the EP1S series in 1020-BGA (vs EP1S25F1020C6N)
- Higher I/O count than 780-BGA siblings (vs EP1S30F780C7)
- Commercial temperature 0-85C at speed grade 6 (vs EP1S30F1020I7N)
Design Notes
The 1020-BGA uses 1.0 mm ball pitch, which demands a multi-layer PCB stackup with micro-via or laser-drilled vias. A 4- or 6-layer build is feasible with HDI (high-density interconnect) processes. Use a 0.5-0.8 mm diameter land pad and NSMD (non-solder-mask-defined) pads for reliable reflow. Escape routing on the top layer should fan out to a 0.5 mm via pitch, then inner-layer breakouts to keep impedance controlled. The 33x33 mm body requires a panel-level thermal relief copper pour to spread the heat from 32,470 toggling logic elements.
The EP1S30F1020C6N is obsolete and not recommended for new designs without long-term availability risk assessment. Supply is limited to remaining distributor stock, and prices fluctuate significantly. Engineers should also note that Quartus II software is required for design entry (latest version supporting EP1S series is Quartus II v13.0sp1). For new designs, consider Stratix II (EP2S series) or later generations, which have lower power, higher logic density, and active support. Pin-compatible migration to EP1S30F1020C7N or EP1S30F1020I6N works on the same 1020-BGA footprint but is still an obsolete silicon.
Estimated: At typical 50% toggle rate and 1.5 V core at 200 MHz, the EP1S30F1020C6N draws approximately 4-6 W of core power. The 33x33 mm BGA has theta_JA in the 8-12 C/W range with adequate bottom-side thermal balls exposed to PCB copper. Design the PCB with at least 1 oz copper on the inner layers directly under the BGA and 2 oz on the top layer to spread heat. No external heatsink is normally required; however, sealed enclosures should include a heat-spreader plate contacting the top of the BGA via a thermal interface material.
Compliance Information
The EP1S30F1020C6N is an obsolete Intel/Altera Stratix FPGA. The 'N' suffix typically indicates lead-free terminal finish per Altera's historical nomenclature, but RoHS/REACH compliance was not explicitly confirmed in the verified data. AEC-Q100 is not applicable since this is a commercial-grade FPGA, not an automotive-qualified part.
