EP20K400GC655-3V vs EP20K400GI655-1V Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP20K400GC655-3V tarafından Intel ve EP20K400GI655-1V tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Intel
EP20K400GI655-1V - APEX 20K 400K Gate FPGA, 655-pin CBGA | Intel
EP20K400GI655-1V ⚠ Son Satın AlmaÖzellik Karşılaştırması
| Parametre | EP20K400GC655-3V | EP20K400GI655-1V |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Obsolete | Son Alış Zamanı |
| Series | APEX-20KC | — |
| Family | APEX 20KC (Apex 20KE Device Family, 1.8 V, LVDS) | APEX 20K |
| Manufacturer | Altera (now Intel) | — |
| Core Supply Voltage | 1.71 V to 1.89 V (1.8 V nominal) | 2.5 V |
| Logic Elements | 16640 | 16,640 |
| Total RAM Bits | 212992 | — |
| Typical Gate Count | 400000 | — |
| Number of User I/O | 496 | — |
| Azami Saat Hızı | 714.2 MHz | — |
| Propagation Delay | 3.6 ns | 2.5 ns |
| Speed Grade | -3V (commercial temperature, Vcc 1.8 V) | — |
| Paket | 655-BCPGA (62.48 mm x 62.48 mm) | — |
| Package Equivalence Code | SPGA655, 47x47 | SPGA655, 47x47 |
| Montaj Türü | Through Hole (CPGA) | — |
| Peak Reflow Temperature | 220 C | — |
| Process Technology | CMOS | CMOS |
| Configuration | SRAM-based (requires EPC configuration device) | In-system programmable via JTAG |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) | — |
| RoHS Durumu | [DATA_NEEDED: RoHS compliance flag - BCPGA package often non-RoHS] | [DATA_NEEDED] |
| İşletim Sıcaklığı | [DATA_NEEDED: commercial / industrial / military grade] | [DATA_NEEDED: industrial vs military grade] |
| Typical Gates | — | 400,000 |
| Maximum User I/O | — | 502 |
| Dedicated Inputs | — | 4 |
| Package Type | — | CBGA-655 (Ceramic Ball Grid Array) |
| Package Code (JESD-30) | — | S-CPGA-P655 |
| I/O Supply Voltage | — | 2.5 V / 3.3 V |
| Boundary Scan | — | IEEE 1149.1 JTAG |
| MSL Seviyesi | — | 1 |
| Package Body Material | — | Ceramic |