EP2SGX30CF780C6 vs EP2SGX30CF780C3 Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP2SGX30CF780C6 tarafından Intel ve EP2SGX30CF780C3 tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EP2SGX30CF780C6 | EP2SGX30CF780C3 |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | NRND | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Series | EP2SGX | — |
| Logic Elements (LE) | 33,880 | — |
| Adaptive Logic Modules (ALM) | 13,540 | — |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) | — |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) | — |
| User I/O Pins | 361 | — |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Paket | 780-ball FineLine BGA (F780) | 780-ball FineLine BGA |
| Speed Grade | C6 (commercial, mid-speed) | -3 |
| İşletim Sıcaklığı | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage | 1.2 V (typical) | — |
| Configuration Mode | Enhanced passive/active (EPC) supported | — |
| Process Technology | 90 nm | — |
| RoHS Durumu | [DATA_NEEDED: RoHS status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | Yes |
| Logic Elements | — | 33,880 |
| Logic Array Blocks (LABs) | — | 1,694 |
| Embedded RAM Bits | — | 1,369,728 |
| User I/Os | — | 361 |
| Process Node | — | 90 nm |
| Transceivers | — | Embedded (GX family, up to 3.125 Gbps per channel) |
| Memory Interfaces | — | DDR / DDR2 / QDRII PHY |
| Montaj Türü | — | Surface Mount (BGA) |
| Klorürsüz | — | [DATA_NEEDED: halogen-free status] |