EP3C55F484C7 vs EP3C55F484C8 Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP3C55F484C7 tarafından Intel ve EP3C55F484C8 tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EP3C55F484C7 | EP3C55F484C8 |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Son Alış Zamanı | Aktif |
| Device Family | Cyclone III | Cyclone® III |
| Logic Elements (LE) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,495 | 3,491 |
| Embedded Memory Bits | 2,396,160 bits | 2,396,160 bits |
| Embedded Memory (M9K blocks) | 260 blocks of 9 Kbit each | — |
| Embedded 18x18 Multipliers | 156 | 312 |
| Maximum User I/Os | 327 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Internal Operating Frequency (max) | 472 MHz | — |
| Process Technology | 65 nm TSMC low-k CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Paket | FBGA-484 (FineLine BGA, 23 × 23 mm, 1.0 mm pitch) | 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height |
| Operating Temperature Grade | Commercial (0 °C to +85 °C) - C7 speed grade | — |
| Montaj Türü | Surface Mount (BGA) | — |
| RoHS Durumu | Compliant (lead-free FBGA) | — |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG | — |
| Configuration Memory Type | SRAM (volatile, requires external flash) | — |
| Logic Elements (LEs) | — | 55,856 |
| User I/Os | — | 327 |
| Maximum Core Frequency | — | 472.5 MHz |
| Speed Grade | — | C8 (commercial, -8) |
| İşletim Sıcaklığı | — | Commercial (0C to +85C) |
| Configuration Modes | — | JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) |
| Lead-Free / RoHS | — | Yes (Pb-free FBGA) |
| Besleme Gerilimi | — | Core 1.2 V typical, I/O bank dependent |
| I/O Standards Supported | — | LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others |