P1011NSE2FFB vs P1020NSE2FFB Karşılaştırma
Ayrıntılı yan yana karşılaştırma P1011NSE2FFB tarafından NXP Semiconductors ve P1020NSE2FFB tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
P1011NSE2FFB - QorIQ P1 800MHz e500v2 SoC, 1-Core | NXP
P1011NSE2FFB ✗ Son Kullanım ZamanıNXP Semiconductors
P1020NSE2FFB - QorIQ P1 Dual-Core 800MHz SoC | NXP Semiconductors
P1020NSE2FFB ⚠ Son Satın AlmaÖzellik Karşılaştırması
| Parametre | P1011NSE2FFB | P1020NSE2FFB |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Hayat Dönemi Sonu | Son Alış Zamanı |
| Core Architecture | PowerPC e500v2 | — |
| Number of Cores | 1 | 2 |
| Core Frequency (Max) | 800 MHz | — |
| Bit Width | 32-bit | — |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache | — |
| L2 Cache | 256 KB with ECC | — |
| Process Technology | 45 nm | 45 nm |
| Paket | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) |
| Ethernet MACs | 3 × 10/100/1000 Mbps | — |
| Memory Controller | DDR2/DDR3 with ECC, up to 800 MT/s | DDR2/DDR3 with ECC |
| PCIe Controllers | 2 × PCIe Gen 1 (x4/x2 or x4+x1) | — |
| USB | USB 2.0 High-Speed with ULPI | USB 2.0 |
| TDM/HDLC Channels | 4 | — |
| Security Engine | SEC 2.0 (crypto accelerator) | SEC (hardware-accelerated crypto) |
| Local Bus | 32-bit | — |
| İşletim Sıcaklığı | 0°C to +125°C | 0C to 125C (Tj) |
| Typical Power Dissipation | [DATA_NEEDED: TDP figure] | — |
| RoHS Durumu | RoHS Compliant (Lead Free) | — |
| MSL Seviyesi | 3 | — |
| Processor Type | — | QorIQ P1 series, dual-core PowerPC e500v2 |
| Core Frequency | — | 667 MHz (core), 333 MHz (platform), 667 MHz (core2) |
| Marketing / Maximum Frequency | — | 800 MHz |
| Veri Bus Genişliği | — | 32-bit |
| Ethernet | — | Integrated GbE (3x MAC) |
| PCIe | — | PCIe Gen1 / Gen2 |
| TDM / Serial Interface | — | Yes (TDM) |
| Package Type | — | 689-BBGA Exposed Pad (Tray) |
| Lead Free / RoHS | — | Lead Free, RoHS Compliant |
| Besleme Gerilimi | — | [DATA_NEEDED: exact Vcore/Vdd nominal] |
| Junction Temperature Max | — | 125 C |