S9S08QD4J2MSC vs MC9S08QD4CSC Karşılaştırma
Ayrıntılı yan yana karşılaştırma S9S08QD4J2MSC tarafından NXP Semiconductors ve MC9S08QD4CSC tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP
S9S08QD4J2MSC ✓ AktifNXP Semiconductors
MC9S08QD4CSC - 8-bit S08 MCU 4KB Flash 16MHz | NXP
MC9S08QD4CSC ✗ Son Kullanım ZamanıÖzellik Karşılaştırması
| Parametre | S9S08QD4J2MSC | MC9S08QD4CSC |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Aktif | Hayat Dönemi Sonu |
| Manufacturer | NXP Semiconductors | — |
| Core Architecture | HCS08 (8-bit, HC08-compatible with BGND) | — |
| CPU Frequency | 16 MHz | — |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 256 bytes | 256 B |
| Paket | 8-SOIC (0.154", 3.90 mm width) | 8-SOIC |
| Montaj Türü | Surface Mount | Surface Mount |
| İşletim Sıcaklığı | -40C to +125C (automotive grade) | [DATA_NEEDED: operating temperature range] |
| AEC-Q100 Qualification | Qualified | — |
| Pin Sayısı | 8 | — |
| General-Purpose I/O Pins | 4 (plus 1 input-only and 1 output-only pin) | — |
| Besleme Gerilimi | [DATA_NEEDED: VDD range] | 3.3 V / 5 V |
| ADC | On-chip ADC (channel count per datasheet) | — |
| Timers | On-chip timer(s) | — |
| Communication | SCI/SPI (per datasheet) | — |
| Debug Interface | Background Debug Mode (BDM) with breakpoints | Background debugging system (single-wire BDM) |
| Low-Power Modes | STOP and WAIT | — |
| RoHS Durumu | [DATA_NEEDED: RoHS status] | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Azami Saat Hızı | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tube |
| Life Cycle Stage | — | End of Life (per NXP product page) |