EDB2432B4MA-1DAUT-F-R - 2Gbit LPDDR2 DRAM 533MHz | Micron
MPN: EDB2432B4MA-1DAUT-F-R ✓ AktifEDB2432B4MA-1DAUT-F-R Genel Bakış
LPDDR2 (Low Power Double Data Rate 2) is a type of synchronous DRAM optimized for mobile and embedded systems. As a member of the broader DDR SDRAM family and power-management-aware memory hierarchy, LPDDR2 reduces core voltage compared with DDR3 and integrates the memory controller interface functions that simplify designs in battery-powered and thermally constrained platforms such as telematics control units, infotainment processors, and ADAS domains.
Key features of this device include a parallel interface, double-die package (DDP) architecture that packs two dies in a single 134-VFBGA footprint to achieve 2 Gbit density, a 32-bit data bus width, and the -1D speed grade supporting a 533 MHz clock rate. The automotive temperature rating (indicated by AUT in the ordering code) and lead-free F-thermally enhanced ball assignment make it suitable for under-dash and near-engine electronic modules.
Architecturally, the DDP configuration presents a unified 64M x 32 organization across two stacked dies, with chip-select-based die selection handled by the LPDDR2 host controller. Micron fabricates the part on a low-voltage process that keeps I/O and core rails within the JEDEC LPDDR2 1.2 V class, minimizing power dissipation in standby and self-refresh states.
Typical applications include automotive infotainment head units, instrument clusters, telematics gateways, ADAS sensor-fusion processors, and rugged industrial embedded boards where a 2 Gbit LPDDR2 with wide temperature tolerance is required alongside application processors such as those from NXP, Renesas, or TI.
When designing with this memory, verify that your host controller supports the DDP chip-select mapping and confirm power-rail sequencing for VDD1/VDD2 per the manufacturer datasheet.
This page synthesizes distributor pricing, drop-in alternatives within the EDB2432B4 family, and practical design guidance not consolidated in the manufacturer datasheet. Prices are as of 2026-09-03.
Drop-in alternatifler için EDB2432B4MA-1DAUT-F-R — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller EDB2432B4MA-1DAUT-F-R (aynı form faktörü ve ayağa oturma) — farklı olan Memory Size, Memory Type, Operating Temperature.
EDB2432B4MA-1DAUT-F-D
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EDB2432B4MA-1DAUT-F-D
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EDB2432B4MA-1DIT-F-D
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
EDB2432B4MA-1DIT-F
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
EDB2432B4MA-1DAUT-F-D TR
✅ Yerleştirme📋 Katalogda Olmayan Referans Alternatifi
EDB2432B4MA-1DAUT-F-R Maksimum Değerlendirmeler & Elektriksel Özellikler
| Bellek Türü | LPDDR2 SDRAM (DRAM, mobile LPDDR2) |
| Bellek Boyutu | 2 Gbit |
| Organizasyon | 64M x 32 |
| Arayüz | Parallel |
| Clock Frequency | 533 MHz |
| Supply Voltage (Min) | 1.14 V |
| Supply Voltage (Max) | 1.3 V |
| Paket / Kas | 134-VFBGA (10 x 11.5 mm) |
| Die Package Configuration | DDP (Double Die Package) |
| İşletim Sıcaklığı | -40C to +125C |
| Grade | Automotive (AUT) |
| Montaj Türü | Surface Mount |
| Terminal Count | 134 |
| Memory Circuits | 1 |
| Packaging | Tape & Reel (TR suffix) |
EDB2432B4MA-1DAUT-F-R ddp (double die package) Pin Yapısı Kılavuzu
EDB2432B4MA-1DAUT-F-R (ddp (double die package) paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: EDB2432B4MA-1DAUT-F-R.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
EDB2432B4MA-1DAUT-F-R için uygundur 6 uygulamas: Automotive Infotainment Head Units, Telematics Control Units (TCU), Instrument Clusters and Digital Displays, ADAS Sensor-Fusion Processors, Rugged Industrial Embedded Boards, Portable and Battery-Powered Test Instruments.
Automotive Infotainment Head Units
The EDB2432B4MA-1DAUT-F-R fits automotive infotainment head units because its 2 Gbit density and 64M x 32 organization provide the 256 MB working memory typical for map rendering, media buffering, and HMI graphics alongside mid-range SoCs. Its 533 MHz parallel LPDDR2 interface delivers up to 4.2 GB/s of peak bandwidth, sufficient for smooth UI animation and navigation tile streaming. The -40C to +125C automotive rating and 1.14 V to 1.3 V supply range align with cabin and dash environments, while the 134-VFBGA (10 x 11.5 mm) footprint conserves PCB area behind the display. Placed close to the host processor with matched-length 32-bit data traces and on-die-termination settings from the controller driver, the DDP configuration keeps signal integrity stable across the full temperature range without external terminations.
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Telematics Control Units (TCU)
Telematics control units benefit from the EDB2432B4MA-1DAUT-F-R's combination of 2 Gbit capacity, 533 MHz LPDDR2 bandwidth, and -40C to +125C operation, which covers engine-bay-adjacent mounting and cold-crank conditions. The 64M x 32 organization matches the 32-bit LPDDR2 memory ports common on telematics processors, while the DDP architecture doubles density within a single 134-VFBGA footprint, simplifying BOM management. Its 1.14 V to 1.3 V supply allows sharing a regulated 1.2 V rail from the TCU power-management IC, and self-refresh modes keep session state alive during low-power keep-awake periods on the vehicle battery. Firmware for protocol stacks (LTE/C-V2X) and OTA staging buffers fits comfortably in the 256 MB array, making this part a standard drop for connected-vehicle gateway designs.
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Instrument Clusters and Digital Displays
Digital instrument clusters use the EDB2432B4MA-1DAUT-F-R to back framebuffer and graphics memory for cluster SoCs. The 2 Gbit capacity supports double-buffered displays up to HD resolution with layer composition, and the 533 MHz interface sustains the sustained read bandwidth needed for smooth gauge animation at 60 frames per second. The automotive -40C to +125C range tolerates direct solar heating of the cluster assembly, and the 10 x 11.5 mm 134-VFBGA package fits dense cluster PCBs that combine display bridges, audio, and connectivity. Because the DDP presents a single 64M x 32 bank domain to the controller, software bring-up is straightforward with standard LPDDR2 drivers, and the low 1.2 V class supply keeps total cluster power within automotive budget targets during cranking transients.
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ADAS Sensor-Fusion Processors
In ADAS domains, the EDB2432B4MA-1DAUT-F-R provides 256 MB of working memory for sensor-fusion algorithms processing camera, radar, and ultrasonic data streams. The 64M x 32 LPDDR2 organization with 533 MHz operation supplies roughly 4.2 GB/s peak bandwidth for feature-extraction pipelines and object-tracking buffers, and the deterministic LPDDR2 controller scheduling helps meet functional-safety latency budgets. The automotive rating (-40C to +125C) supports front-camera modules mounted behind the windshield where solar load is severe, and the 134-VFBGA 10 x 11.5 mm footprint eases thermal and layout planning in compact camera brackets. Designers should allocate thermal vias under the ball field and follow the datasheet drive-strength and ODT programming to maintain eye diagrams across the full temperature span.
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Rugged Industrial Embedded Boards
Industrial embedded controllers deployed outdoors or in factory enclosures adopt the EDB2432B4MA-1DAUT-F-R when board operating ranges exceed industrial memory limits. The -40C to +125C rating with automotive screening provides margin against enclosure heat soak, and the 2 Gbit LPDDR2 capacity runs Linux-based control software with ample heap. The 533 MHz, 32-bit parallel interface connects directly to industrial SoCs and MPUs, and the 1.14 V to 1.3 V supply range tolerates rail droop under long cable-harness power delivery. The DDP 134-VFBGA package keeps memory routing within one region of the board, shortening flight times and simplifying impedance control at the 10 x 11.5 mm footprint. Designers typically pair it with industrial NOR flash for boot code and rely on LPDDR2 self-refresh for fast resume from low-power idle.
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Portable and Battery-Powered Test Instruments
Handheld and portable test instruments, including data loggers and field diagnostics tools, use the EDB2432B4MA-1DAUT-F-R for its low 1.2 V class LPDDR2 power and self-refresh retention. The 2 Gbit array stores long acquisition buffers and analysis workspaces, while the 533 MHz interface supports real-time waveform rendering on embedded displays. Although this part is automotive-screened, the extended -40C to +125C range gives field instruments margin against vehicle bays, outdoor panels, and cold-chain environments. The 134-VFBGA (10 x 11.5 mm) package minimizes board area in handheld enclosures, and the 64M x 32 DDP organization means a single footprint upgrade path from 1 Gbit designs in the same family. Battery life benefits from LPDDR2 power-down states during idle sampling periods.
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Önerilen Ürünler Özeti
Mühendislik referans verileri: EDB2432B4MA-1DAUT-F-R — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | EDB2432B4MA-1DAUT-F-D | EDB2432B4MA-1DAUT-F | EDB2432B4MA-1DIT-F-D | EDB2432B4MA-1DIT-F |
|---|---|---|---|---|---|
| Package | 134-VFBGA (10 x 11.5 mm) | 134-VFBGA (10 x 11.5 mm) - same | 134-VFBGA (10 x 11.5 mm) - same | 134-VFBGA (10 x 11.5 mm) - same | 134-VFBGA (10 x 11.5 mm) - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Memory Size | 2 Gbit | 2 Gbit | 2 Gbit | 2 Gbit | 2 Gbit |
| Organization | 64M x 32 | 64M x 32 | 64M x 32 | 64M x 32 | 64M x 32 |
| Clock Frequency | 533 MHz | 533 MHz | 533 MHz | 533 MHz | 533 MHz |
| Supply Voltage | 1.14 V to 1.3 V | 1.14 V to 1.3 V | 1.14 V to 1.3 V | 1.14 V to 1.3 V | 1.14 V to 1.3 V |
| Operating Temperature | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Configuration | DDP | DDP | DDP | DDP | DDP |
| Packing Option | Tape & Reel (-R) | Tray (-D) | Base order code | Tray (-D) | Base order code |
Ana Farklılayıcılar
- Extended automotive temperature range (karşılaştırma:EDB2432B4MA-1DIT-F-D)
- Tape-and-reel packing for high-volume SMT (karşılaştırma:EDB2432B4MA-1DAUT-F-D)
- 2 Gbit density in a single DDP footprint (karşılaştırma:EDB1332BDBH-1DAUT-F-R)
Tasarım Notları
Route the 32-bit LPDDR2 data bus and DQS strobes as matched-length groups; keep fly-by or point-to-point trace skew within controller specifications (typically a few tens of picoseconds for LPDDR2 class). Use the SoC LPDDR2 controller drive-strength and ODT programming tables in the Micron datasheet to tune impedance for your stackup. Simulate eye diagrams at 533 MHz across the -40C to +125C range, since automotive die corners shift timing compared with commercial grades.
Provide a tightly regulated 1.2 V rail (1.14 V to 1.3 V window) from the PMIC LPDDR2 regulator, and follow the VDD1/VDD2 power-up sequencing order specified in the manufacturer datasheet before releasing CKE. Add bulk capacitance near the ball field plus local 100 nF ceramics on each rail; the DDP doubles peak current compared with single-die parts, so verify PMIC transient response at 533 MHz burst traffic. Estimated: peak current scales roughly with die count, so budget for both dies toggling simultaneously.
Place the 134-VFBGA (10 x 11.5 mm) footprint within approximately 50 mm of the host processor to keep flight times short, and fan out address/command lines on inner layers with solid reference planes. Use non-solder-mask-defined (NSMD) pads per the Micron package outline and add a via-in-pad or dog-bone fanout grid for the 134-ball array. Thermal vias under the center of the ball field improve heat spreading for -40C to +125C automotive ambient conditions.
The DDP configuration presents two dies behind the chip-select mapping; confirm your controller device tree or memory configuration supports DDP so both 64M x 32 dies are enumerated - otherwise only half the 2 Gbit array is visible. Also note EDB2432B4MA-1DAUT-F-D appears in Micron's obsolete catalog listings for some packing variants; validate lifecycle status of the exact order code before committing to new designs.
Uyumluluk Bilgisi
The -F suffix in the ordering code conventionally denotes lead-free/RoHS processing in Micron nomenclature, and the family is described as Automotive LPDDR2 in distributor datasheet listings; explicit RoHS/REACH certificate values were not present in the retrieved web data and should be confirmed on the Micron product page.
