EDB2432B4MA-1DAUT-F-R - 2Gbit LPDDR2 DRAM 533MHz | Micron
MPN: EDB2432B4MA-1DAUT-F-R β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $19.32 | $19.32 |
| 10 | $17.9 | $179.00 |
| 100 | $16.25 | $1,625.00 |
| 500 | $14.8 | $7,400.00 |
| 1,000 | $13.65 | $13,650.00 |
Drop-in alternatives for EDB2432B4MA-1DAUT-F-R β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EDB2432B4MA-1DAUT-F-D
β Drop-Inβ In Stock
$7.43 / Unit
View Datasheet βEDB2432B4MA-1DAUT-F-D
β Drop-Inβ In Stock
$7.43 / Unit
View Datasheet βEDB2432B4MA-1DIT-F-D
β Drop-Inπ Reference alternative (not in catalog)
EDB2432B4MA-1DIT-F
β Drop-Inπ Reference alternative (not in catalog)
EDB2432B4MA-1DAUT-F-D TR
β Drop-Inπ Reference alternative (not in catalog)
EDB2432B4MA-1DAUT-F-R Maximum Ratings & Electrical Characteristics
| Memory Type | LPDDR2 SDRAM (DRAM, mobile LPDDR2) |
| Memory Size | 2 Gbit |
| Organization | 64M x 32 |
| Interface | Parallel |
| Clock Frequency | 533 MHz |
| Supply Voltage (Min) | 1.14 V |
| Supply Voltage (Max) | 1.3 V |
| Package / Case | 134-VFBGA (10 x 11.5 mm) |
| Die Package Configuration | DDP (Double Die Package) |
| Operating Temperature | -40C to +125C |
| Grade | Automotive (AUT) |
| Mounting Type | Surface Mount |
| Terminal Count | 134 |
| Memory Circuits | 1 |
| Packaging | Tape & Reel (TR suffix) |
EDB2432B4MA-1DAUT-F-R ddp (double die package) Pin Configuration Guide
Complete pinout information for EDB2432B4MA-1DAUT-F-R (ddp (double die package) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EDB2432B4MA-1DAUT-F-R.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EDB2432B4MA-1DAUT-F-R is suitable for 6 applications: Automotive Infotainment Head Units, Telematics Control Units (TCU), Instrument Clusters and Digital Displays, ADAS Sensor-Fusion Processors, Rugged Industrial Embedded Boards, Portable and Battery-Powered Test Instruments.
Automotive Infotainment Head Units
The EDB2432B4MA-1DAUT-F-R fits automotive infotainment head units because its 2 Gbit density and 64M x 32 organization provide the 256 MB working memory typical for map rendering, media buffering, and HMI graphics alongside mid-range SoCs. Its 533 MHz parallel LPDDR2 interface delivers up to 4.2 GB/s of peak bandwidth, sufficient for smooth UI animation and navigation tile streaming. The -40C to +125C automotive rating and 1.14 V to 1.3 V supply range align with cabin and dash environments, while the 134-VFBGA (10 x 11.5 mm) footprint conserves PCB area behind the display. Placed close to the host processor with matched-length 32-bit data traces and on-die-termination settings from the controller driver, the DDP configuration keeps signal integrity stable across the full temperature range without external terminations.
Recommended
Telematics Control Units (TCU)
Telematics control units benefit from the EDB2432B4MA-1DAUT-F-R's combination of 2 Gbit capacity, 533 MHz LPDDR2 bandwidth, and -40C to +125C operation, which covers engine-bay-adjacent mounting and cold-crank conditions. The 64M x 32 organization matches the 32-bit LPDDR2 memory ports common on telematics processors, while the DDP architecture doubles density within a single 134-VFBGA footprint, simplifying BOM management. Its 1.14 V to 1.3 V supply allows sharing a regulated 1.2 V rail from the TCU power-management IC, and self-refresh modes keep session state alive during low-power keep-awake periods on the vehicle battery. Firmware for protocol stacks (LTE/C-V2X) and OTA staging buffers fits comfortably in the 256 MB array, making this part a standard drop for connected-vehicle gateway designs.
Recommended
Instrument Clusters and Digital Displays
Digital instrument clusters use the EDB2432B4MA-1DAUT-F-R to back framebuffer and graphics memory for cluster SoCs. The 2 Gbit capacity supports double-buffered displays up to HD resolution with layer composition, and the 533 MHz interface sustains the sustained read bandwidth needed for smooth gauge animation at 60 frames per second. The automotive -40C to +125C range tolerates direct solar heating of the cluster assembly, and the 10 x 11.5 mm 134-VFBGA package fits dense cluster PCBs that combine display bridges, audio, and connectivity. Because the DDP presents a single 64M x 32 bank domain to the controller, software bring-up is straightforward with standard LPDDR2 drivers, and the low 1.2 V class supply keeps total cluster power within automotive budget targets during cranking transients.
Recommended
ADAS Sensor-Fusion Processors
In ADAS domains, the EDB2432B4MA-1DAUT-F-R provides 256 MB of working memory for sensor-fusion algorithms processing camera, radar, and ultrasonic data streams. The 64M x 32 LPDDR2 organization with 533 MHz operation supplies roughly 4.2 GB/s peak bandwidth for feature-extraction pipelines and object-tracking buffers, and the deterministic LPDDR2 controller scheduling helps meet functional-safety latency budgets. The automotive rating (-40C to +125C) supports front-camera modules mounted behind the windshield where solar load is severe, and the 134-VFBGA 10 x 11.5 mm footprint eases thermal and layout planning in compact camera brackets. Designers should allocate thermal vias under the ball field and follow the datasheet drive-strength and ODT programming to maintain eye diagrams across the full temperature span.
Recommended
Rugged Industrial Embedded Boards
Industrial embedded controllers deployed outdoors or in factory enclosures adopt the EDB2432B4MA-1DAUT-F-R when board operating ranges exceed industrial memory limits. The -40C to +125C rating with automotive screening provides margin against enclosure heat soak, and the 2 Gbit LPDDR2 capacity runs Linux-based control software with ample heap. The 533 MHz, 32-bit parallel interface connects directly to industrial SoCs and MPUs, and the 1.14 V to 1.3 V supply range tolerates rail droop under long cable-harness power delivery. The DDP 134-VFBGA package keeps memory routing within one region of the board, shortening flight times and simplifying impedance control at the 10 x 11.5 mm footprint. Designers typically pair it with industrial NOR flash for boot code and rely on LPDDR2 self-refresh for fast resume from low-power idle.
Recommended
Portable and Battery-Powered Test Instruments
Handheld and portable test instruments, including data loggers and field diagnostics tools, use the EDB2432B4MA-1DAUT-F-R for its low 1.2 V class LPDDR2 power and self-refresh retention. The 2 Gbit array stores long acquisition buffers and analysis workspaces, while the 533 MHz interface supports real-time waveform rendering on embedded displays. Although this part is automotive-screened, the extended -40C to +125C range gives field instruments margin against vehicle bays, outdoor panels, and cold-chain environments. The 134-VFBGA (10 x 11.5 mm) package minimizes board area in handheld enclosures, and the 64M x 32 DDP organization means a single footprint upgrade path from 1 Gbit designs in the same family. Battery life benefits from LPDDR2 power-down states during idle sampling periods.
Recommended
Recommended Products Summary
Engineering reference data for EDB2432B4MA-1DAUT-F-R β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EDB2432B4MA-1DAUT-F-D | EDB2432B4MA-1DAUT-F | EDB2432B4MA-1DIT-F-D | EDB2432B4MA-1DIT-F |
|---|---|---|---|---|---|
| Package | 134-VFBGA (10 x 11.5 mm) | 134-VFBGA (10 x 11.5 mm) - same | 134-VFBGA (10 x 11.5 mm) - same | 134-VFBGA (10 x 11.5 mm) - same | 134-VFBGA (10 x 11.5 mm) - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Memory Size | 2 Gbit | 2 Gbit | 2 Gbit | 2 Gbit | 2 Gbit |
| Organization | 64M x 32 | 64M x 32 | 64M x 32 | 64M x 32 | 64M x 32 |
| Clock Frequency | 533 MHz | 533 MHz | 533 MHz | 533 MHz | 533 MHz |
| Supply Voltage | 1.14 V to 1.3 V | 1.14 V to 1.3 V | 1.14 V to 1.3 V | 1.14 V to 1.3 V | 1.14 V to 1.3 V |
| Operating Temperature | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Configuration | DDP | DDP | DDP | DDP | DDP |
| Packing Option | Tape & Reel (-R) | Tray (-D) | Base order code | Tray (-D) | Base order code |
Key Differentiators
- Extended automotive temperature range (vs EDB2432B4MA-1DIT-F-D)
- Tape-and-reel packing for high-volume SMT (vs EDB2432B4MA-1DAUT-F-D)
- 2 Gbit density in a single DDP footprint (vs EDB1332BDBH-1DAUT-F-R)
Design Notes
Route the 32-bit LPDDR2 data bus and DQS strobes as matched-length groups; keep fly-by or point-to-point trace skew within controller specifications (typically a few tens of picoseconds for LPDDR2 class). Use the SoC LPDDR2 controller drive-strength and ODT programming tables in the Micron datasheet to tune impedance for your stackup. Simulate eye diagrams at 533 MHz across the -40C to +125C range, since automotive die corners shift timing compared with commercial grades.
Provide a tightly regulated 1.2 V rail (1.14 V to 1.3 V window) from the PMIC LPDDR2 regulator, and follow the VDD1/VDD2 power-up sequencing order specified in the manufacturer datasheet before releasing CKE. Add bulk capacitance near the ball field plus local 100 nF ceramics on each rail; the DDP doubles peak current compared with single-die parts, so verify PMIC transient response at 533 MHz burst traffic. Estimated: peak current scales roughly with die count, so budget for both dies toggling simultaneously.
Place the 134-VFBGA (10 x 11.5 mm) footprint within approximately 50 mm of the host processor to keep flight times short, and fan out address/command lines on inner layers with solid reference planes. Use non-solder-mask-defined (NSMD) pads per the Micron package outline and add a via-in-pad or dog-bone fanout grid for the 134-ball array. Thermal vias under the center of the ball field improve heat spreading for -40C to +125C automotive ambient conditions.
The DDP configuration presents two dies behind the chip-select mapping; confirm your controller device tree or memory configuration supports DDP so both 64M x 32 dies are enumerated - otherwise only half the 2 Gbit array is visible. Also note EDB2432B4MA-1DAUT-F-D appears in Micron's obsolete catalog listings for some packing variants; validate lifecycle status of the exact order code before committing to new designs.
Compliance Information
The -F suffix in the ordering code conventionally denotes lead-free/RoHS processing in Micron nomenclature, and the family is described as Automotive LPDDR2 in distributor datasheet listings; explicit RoHS/REACH certificate values were not present in the retrieved web data and should be confirmed on the Micron product page.
