EP3SL200F1517I4 - 200K LE Stratix III L FPGA | Intel (Altera)
MPN: EP3SL200F1517I4 ✗ Son Kullanım ZamanıEP3SL200F1517I4 Genel Bakış
A Field Programmable Gate Array (FPGA) is a semiconductor IC whose logic functionality is defined by the customer after manufacturing. Hierarchically, an FPGA sits inside the broader category of programmable logic devices (PLDs), itself a subset of integrated circuits and digital logic ICs. FPGAs differ from ASICs by offering post-fabrication reconfigurability at the cost of higher per-unit price, area, and dynamic power; the Stratix III L family specifically targets a power-per-logic-element sweet spot between the original Stratix III and the Stratix IV families.
Key features include 200,000 logic elements, 9,152 Kbits embedded memory, 8,000 LABs, 976 user I/Os, and embedded multipliers/DSP blocks. Internal frequency is rated at up to 450 MHz. The 1517-ball FC-FBGA package supports high-pin-count designs with multiple high-speed transceiver and external memory interface (EMIF) banks. The 65 nm process enables higher density at lower static leakage than the 90 nm Stratix II generation.
Typical applications include high-end telecommunications baseband processing, radar and beamforming DSP, ASIC prototyping, high-speed test and measurement, and broadcast video processing. The high logic count makes the part particularly suited to designs that have outgrown mid-density Stratix III devices but do not require the absolute highest density of the Stratix V family.
When designing with this device, plan power delivery for high transient currents during configuration and dynamic reconfiguration. The FC-FBGA package requires careful PCB stackup, microvia or via-in-pad fabrication, and matched-length routing for high-speed serial interfaces. Quartus II is the canonical design toolchain.
This page synthesizes distributor pricing from DigiKey/Mouser, cross-references, and a parametric comparison table not found in the manufacturer datasheet.
Drop-in alternatifler için EP3SL200F1517I4 — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller EP3SL200F1517I4 (aynı form faktörü ve ayağa oturma) — farklı olan Package, Embedded Memory Bits, Process Technology, Speed Grade, Logic Elements.
EP3SL200F1517I3N
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP3SE260F1517I4N
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP3SE260F1517I4
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP3SE110F1517I3N
✅ Yerleştirme ⚠️ Onaylanmamış Özellikler📋 Katalogda Olmayan Referans Alternatifi
EP3SL200F1517C4N
✅ Yerleştirme ⚠️ Onaylanmamış Özellikler📋 Katalogda Olmayan Referans Alternatifi
EP3SL200F1517I4 Maksimum Değerlendirmeler & Elektriksel Özellikler
| Family | Stratix III L |
| Logic Elements | 200,000 |
| Logic Array Blocks (LABs) | 8000 |
| Embedded Memory | 10,901,504 bits (~10.4 Mbit) |
| Maximum User I/Os | 976 |
| Process Node | 65 nm |
| Core Voltage | 1.1 V |
| Internal Frequency | up to 450 MHz |
| Paket | 1517-ball FC-FBGA |
| Montaj Türü | Surface Mount |
| İşletim Sıcaklığı | -40C to +100C (Industrial) |
| Supply Voltage Range | 0.9 V to 1.1 V core |
| RoHS Durumu | Compliant |
| Lead-Free | Yes |
| MSL Seviyesi | 3 |
| Device Type | FPGA - Field Programmable Gate Array |
EP3SL200F1517I4 1517-ball fc-fbga Pin Yapısı Kılavuzu
EP3SL200F1517I4 (1517-ball fc-fbga paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: EP3SL200F1517I4.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
EP3SL200F1517I4 için uygundur 6 uygulamas: ASIC Prototyping, Telecommunications Baseband Processing, Radar and Beamforming DSP, High-Speed Test and Measurement, Broadcast Video Processing, Industrial Control and Automation.
ASIC Prototyping
The EP3SL200F1517I4's 200K logic elements and 10.4 Mbit embedded memory make it a strong fit for ASIC prototyping where engineers need high logic capacity, fast iteration, and Quartus II verification flows. With up to 976 user I/Os, designers can map large multi-million-gate ASICs to a single Stratix III L device, partitioning logic across LABs and TriMatrix memory blocks while preserving timing closure. The 65 nm process and 1.1 V core deliver low static leakage versus older 90 nm FPGA families, which is meaningful when prototyping power-sensitive ASIC designs. Compared to ASIC tape-out, this FPGA approach cuts iteration time from weeks to hours, accepting higher per-unit cost for development-cycle agility.
Önerilen
Telecommunications Baseband Processing
The EP3SL200F1517I4's 200K logic elements and embedded DSP blocks make it well-suited for 3G/4G wireless baseband signal processing, including channel coding, modulation/demodulation, and FFT/iFFT pipelines. With 976 user I/Os and multiple high-speed transceiver banks, the device interfaces cleanly to external ADC/DAC converters, RF front-ends, and CPRI/OBSAI links. The Stratix III L power-optimized architecture delivers lower static leakage than the Stratix III E family, which matters in thermally constrained outdoor base-station enclosures. Designers can leverage Altera's DSP Builder and pre-verified IP cores for turbo decoding and crest-factor reduction.
Önerilen
Radar and Beamforming DSP
The EP3SL200F1517I4's combination of 200K logic elements, embedded multipliers, and 10.4 Mbit memory suits phased-array radar beamforming and pulse-Doppler signal-processing implementations. With 976 user I/Os, designers can aggregate many LVDS data lanes from multi-channel ADCs and route them through parallel FIR filter banks into detection logic. The device's 450 MHz internal frequency supports real-time beam-steering update rates required by modern AESA radars. Compared to GPU-based approaches, this FPGA implementation offers deterministic latency critical for closed-loop beam control. Quartus II DSP Builder accelerates floating-point to fixed-point conversion.
Önerilen
High-Speed Test and Measurement
The EP3SL200F1517I4's 976 user I/Os and high internal logic capacity suit high-channel-count protocol analyzers, logic analyzers, and bit-error-rate testers where the FPGA must aggregate and process data from dozens of high-speed serial links simultaneously. Its embedded TriMatrix memory blocks provide flexible FIFO depths for capturing protocol bursts, while the LVDS-capable I/Os drive multi-Gbps sample rates from external ADC front-ends. The 65 nm process yields sufficient timing margin for 1+ GHz internal datapaths. Compared to discrete logic implementations, this FPGA approach reduces PCB area by an order of magnitude while improving test-pattern flexibility.
Önerilen
Broadcast Video Processing
The EP3SL200F1517I4's logic density and embedded memory suit broadcast video switchers, multi-format frame synchronizers, and SD/HD/3G-SDI routing matrices that require real-time processing at full broadcast frame rates. The 976 user I/Os accommodate many SDI streams routed in parallel, while the embedded memory blocks implement line buffers and look-up tables for color-space conversion. Compared to CPU-based processing, FPGA-based broadcast equipment delivers deterministic frame latency and faster switching between video standards. The Stratix III L architecture provides the low-static-power profile required in always-on broadcast racks.
Önerilen
Industrial Control and Automation
The EP3SL200F1517I4 suits complex industrial controllers for high-axis motion control, multi-protocol industrial networking, and machine-vision inspection systems. With 200K logic elements, designers can integrate EtherCAT, PROFINET, and EtherNet/IP stacks alongside multi-axis servo loops on a single FPGA. The 976 user I/Os accommodate many encoder, GPIO, and high-speed LVDS sensor lanes, while embedded memory implements deterministic position buffers. The -40C to +100C industrial temperature grade supports deployment in factory-floor enclosures without additional thermal management beyond standard heatsinking.
Önerilen
Önerilen Ürünler Özeti
Mühendislik referans verileri: EP3SL200F1517I4 — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | EP3SL200F1517I3N | EP3SE260F1517I4N | EP3SE110F1517I3N | EP3SL200F1517C4N |
|---|---|---|---|---|---|
| Package | 1517-ball FC-FBGA | 1517-ball FC-FBGA | 1517-ball FC-FBGA | 1517-ball FC-FBGA | 1517-ball FC-FBGA |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Family | Stratix III L | Stratix III L | Stratix III E | Stratix III E | Stratix III L |
| Logic Elements | 200,000 | 200,000 | 260,000 | 110,000 | 200,000 |
| Speed Grade | -4 (fastest) | -3 | -4 | -3 | -4 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (Commercial) |
| Embedded Memory | 10.4 Mbit | 10.4 Mbit | 14.0 Mbit | 6.0 Mbit | 10.4 Mbit |
| User I/Os | 976 | 976 | 976 | 744 | 976 |
| Process Node | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Ana Farklılayıcılar
- Highest-density Stratix III L device with 200K LE (karşılaştırma:EP3SL150F1152C4N)
- Lower static power than Stratix III E family at equivalent logic capacity (karşılaştırma:EP3SE260F1517I4N)
- Industrial temperature grade versus commercial-only equivalent (karşılaştırma:EP3SL200F1517C4N)
- Largest pin-count package (1517-ball) for highest I/O density (karşılaştırma:EP3SL200F1152I4N)
Tasarım Notları
Estimated: The 1517-ball FC-FBGA package has 1.0 mm ball pitch. PCB fabrication must support microvia (laser-drilled) or via-in-pad technology. Stackup should be designed for high-speed signal integrity with matched impedance (50 ohm single-ended, 100 ohm differential). Use at least 8 PCB layers with continuous reference planes for transceiver and EMIF signals.
Estimated: At 1.1 V core with 200K LE fully utilized, transient currents during configuration and dynamic reconfiguration can exceed 20 A. Use a buck regulator with at least 30 A capability and place decoupling capacitors (per Quartus II pin connection guidelines) within 100 mils of every power pin. Add 0.1 uF, 1 uF, and 10 uF ceramic caps per power rail per the Stratix III device handbook recommendations.
Estimated: At typical 0.9-1.1 V core with 200K LE utilization, the 1517-ball FC-FBGA dissipates 5-15 W depending on toggle rate. The exposed-die flip-chip BGA requires thermal vias under the package center to conduct heat to internal copper planes. For high-utilization designs, attach a heat spreader or small heatsink; for full-power designs, forced airflow is required.
Estimated: Match-length routing is critical for LVDS and transceiver interfaces. Quartus II Fitter reports will flag skew violations; route within 25 mils of target lengths for LVDS pairs and within tighter tolerances for transceiver channels. Reference-pin placement for differential pairs should follow the Stratix III device handbook pin connection guidelines to avoid signal-integrity issues.
Do not confuse the 'I4' speed/temperature suffix pattern with other Stratix families. Verify Quartus II device support version compatibility (Stratix III support runs through Quartus Prime 16.x). The 1517-ball FC-FBGA package requires factory-programmed MSL3 handling for unopened trays, and assembled boards should be baked before rework to avoid 'popcorn' damage to the package.
Uyumluluk Bilgisi
RoHS compliant and lead-free per Altera/Intel product page and DigiKey environmental data. Halogen-free status should be confirmed with manufacturer's latest material declaration for current programs. AEC-Q100 not applicable for FPGA logic devices.
